生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | GREEN, PLASTIC, NFBGA-361 | 针数: | 361 |
Reach Compliance Code: | unknown | HTS代码: | 8542.31.00.01 |
风险等级: | 5.84 | Is Samacsys: | N |
其他特性: | IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY | JESD-30 代码: | S-PBGA-B361 |
长度: | 13 mm | 端子数量: | 361 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
认证状态: | Not Qualified | 座面最大高度: | 1.3 mm |
最大供电电压: | 1.35 V | 最小供电电压: | 1.25 V |
标称供电电压: | 1.3 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | BALL |
端子节距: | 0.65 mm | 端子位置: | BOTTOM |
宽度: | 13 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
PAM1806BZCE4 | TI | AM1806 ARM Microprocessor |
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PAM1806BZCEA3 | TI | AM1806 ARM Microprocessor |
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PAM1806BZCEA4 | TI | AM1806 ARM Microprocessor |
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PAM1806BZCED3 | TI | AM1806 ARM Microprocessor |
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PAM1806BZCED4 | TI | AM1806 ARM Microprocessor |
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PAM1806BZWT3 | TI | AM1806 ARM Microprocessor |
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