Datasheet > PALCE16V8Q-10PC4

PALCE16V8Q-10PC4

更新时间： 2022-11-26 00:04:35

品牌	Logo	应用领域
超微 - AMD		/
页数	文件大小	规格书
26页	221K
描述
EE CMOS 20-Pin Universal Programmable Array Logic

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AMD

TYPICAL THERMAL CHARACTERISTICS

/4 Devices (PALCE16V8H-10/4)

Measured at 25°C ambient. These parameters are not tested.

Typ

Parameter

Symbol

Parameter Description

PDIP

PLCC

Unit

θjc

Thermal Impedance, Junction to Case

Thermal Impedance, Junction to Ambient

Thermal Impedance, Junction to Ambient with Air Flow

°C/W

θja

θjma

200 Ifpm air

400 Ifpm air

600 Ifpm air

800 Ifpm air

/5 Devices (PALCE16V8H-7/5)

Measured at 25°C ambient. These parameters are not tested.

Typ

Parameter

Symbol

Parameter Description

PDIP

PLCC

Unit

°C/W

θjc

Thermal Impedance, Junction to Case

Thermal Impedance, Junction to Ambient

Thermal Impedance, Junction to Ambient with Air Flow

θja

θjma

200 Ifpm air

400 Ifpm air

600 Ifpm air

800 Ifpm air

Plastic θjc Considerations

The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The

heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the

package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the

package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a

constant temperature. Therefore, the measurements can only be used in a similar environment.

PALCE16V8 Family

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