Plastic Package Facts:
z Plating Material: Plastic Packages- Matte 100% Tin
z Material of Lead Frame: Copper 194, or Alloy 42
z Lead Content of the Plating Material: Lead Free (Less than 0.1%, 1000ppm
by weight)
z Soldering: Maximum Temperature=260 Degree C, Maximum Time=20-40
seconds
z Reflow Profile: Peak Temperature=260 Degree C, Peak Time=20-40
seconds
z Acceptable number of Reflows: 3 times
z Backward Compatibility: Lead Free packages can be soldered using
existing Sn-Pb solder and temperature profiles
z Forward Compatibility: Lead Free Packages can be soldered using lead free
solders and the appropriate higher temperature profiles
z Storage Conditions: Jedec Std. 20, Level 1
Questions:
When does LIS plan to offer Lead Free packaging to its customers?
Q1:
A1:
LIS has begun offering customers Lead Free packaging for plastic packages
as of 1/1/04, per customer request.
When does LIS plan to offer RoHS compliant packaging to its customers?
LIS has begun offering customers RoHS compliant packaging for it plastic
Q2:
A2:
packages as of 1/1/05, per customer request.
Will LIS continue to offer Non-Lead Free (contains lead) packaging to its
Q3:
customers?
Yes, LIS will continue to offer Non-Lead Free packaging, per customer
A3:
request.
How do I order Lead Free parts versus Non-Lead Free Parts?
Q4:
A4:
When ordering, specify "Lead-Free" in your part description on Purchase
Orders and Quotations.
How do I order RoHS Compliant Parts versus Non-RoHS Compliant Parts?
When ordering, specify "RoHS Compliant" in your part description on
Q5:
A5:
Purchase Orders and Quotations.
How will I be able to identify a Lead-Free / RoHS Compliant Part versus a
Q6:
Non-Lead Free Part / Non RoHS Compliant Part?
The Lead-Free RoHS Compliant Part will be marked with the letter "F".
A6:
Are there any additional costs for ordering Lead-Free or RoHS Compliant
Q7: