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PAC003DTFQT PDF预览

PAC003DTFQT

更新时间: 2024-11-30 22:19:51
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CALMIRCO /
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2页 52K
描述
P/Active 1% Tolerance Dual Thevenin Termination Network

PAC003DTFQT 数据手册

 浏览型号PAC003DTFQT的Datasheet PDF文件第2页 
CALIFORNIA MICRO DEVICES  
PACDT  
P/Active 1%Tolerance DualThéveninTermination Network  
Features  
Applications  
Minimal ground bounce, crosstalk  
HSTL termination  
• Thévenin termination  
ECL, TTL termination  
Stable 1% absolute tolerance elements  
16 terminating lines per QSOP package  
Saves board space and reduces assembly cost  
Product Description  
resistance (R1 in parallel with R2) should match the  
impedance of the trace. Ground-bounce and crosstalk  
are virtually eliminated using a proprietary lead-frame  
which includes four direct ground connections to the die  
substrate, as well as four double-bonded connections to  
VCC, for a total of 8 commons. In addition, the resistors  
are trimmed to a tight absolute tolerance of 1% which  
provides tight impedance-matching and results in greatly  
reduced reflections. This unique proprietary design  
provides optimal signal integrity.  
High speed logic devices like HSTL (High Speed  
Transceiver Logic) demand unique, high speed bus  
terminations. The dual Thévenin termination network  
provides 16 terminating channels per package, and  
optimizes signal integrity by reducing reflections and  
ringing. The terminations are available in a range of  
standard values and are ideal for use in HSTL busses.  
As seen in the schematic, R1 is typically tied to VCC and  
serves as a pull-up resistor, while R2 functions as a pull-  
down resistor and is tied to ground (or the most negative  
supply voltage). In addition, the equivalent Thévenin  
BUS IMPEDANCE () R1() R2 () CODE  
47  
50  
56  
68  
94  
94  
001  
002  
003  
004  
Absolute Tolerance (R1 & R2)  
1%  
100  
112  
136  
100  
112  
136  
TCR  
100ppm  
0 C to 70 C  
Operating Temperature Range  
Power Rating/Resistor  
Crosstalk (see Test Circuit)  
Package  
˚
˚
100mW  
30mV TYP  
24 Pin QSOP  
SCHEMATIC CONFIGURATION  
21  
17  
24  
23  
22 20  
19  
18 16  
15  
14  
13  
VCC  
GND  
1
2
3
4
5
6
7
8
9
10  
11  
12  
Package  
Pin  
Ordering Part Number  
R Code  
001  
Style  
QSOP  
QSOP  
QSOP  
QSOP  
Tubes  
Tape & Reel  
Part Marking  
PAC001DTFQ  
PAC002DTFQ  
PAC003DTFQ  
PAC004DTFQ  
24  
24  
24  
24  
PAC001DTFQ/T  
PAC002DTFQ/T  
PAC003DTFQ/T  
PAC004DTFQ/T  
PAC001DTFQ/R  
PAC002DTFQ/R  
PAC003DTFQ/R  
PAC004DTFQ/R  
002  
003  
004  
© 2000 California Micro Devices Corp. All rights reserved.  
C1611100  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
11/19/2000  
1

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