Datasheet > PA01160-B0

PA01160-B0

更新时间： 2024-09-15 19:10:39

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PA01160-B0 数据手册

DIP Socket Series

Page 1 of 3

DIP

Contents:

Key Features

Materials/Finishes

Specifications

Order Information

Key Features

FEATURES

Insertion Force: Low Insertion Force

Frame Style: Open Frame

Applied to Chip Width: 0.4", 0.6" Chip Width

Package: Tube

Materials/Finishes

MATERIALS/FINISHES

CONTACT

Phosphor Bronze Alloy, Hot Tin Dip, 60 u" Thickness.

HOUSING

Thermoplastic PBT, UL 94V-0

http://www.foxconn.com/pd_dip.htm

6/15/98

12 3

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型号	品牌	获取价格	描述	数据表
PA01160-B0-T	FOXCONN	获取价格	IC Socket, DIP32, 32 Contact(s)
PA01160-T	FOXCONN	获取价格	IC Socket, DIP32, 32 Contact(s),
PA01170-T	FOXCONN	获取价格	IC Socket
PA011-LF	PROTEC	获取价格	Low-Voltage, Low RON, Single SPDT Analog Switch.
PA-012	ADAM-TECH	获取价格	Non-Fused
PA01200-T	FOXCONN	获取价格	IC Socket
PA01210-T	FOXCONN	获取价格	IC Socket
PA0121-S	ETC	获取价格	LQFP-128/PQFP-128 (0.5MM PITCH,
PA0122-S	ETC	获取价格	LQFP-128 (0.5MM PITCH, 20X20MM B
PA01265-4W	MTRONPTI	获取价格	Class AB linear GaN design, Dual Band, Manual Relay Switching