Datasheet > P4C1681-12LMB

P4C1681-12LMB

更新时间： 2024-11-26 00:26:07

品牌	Logo	应用领域
PYRAMID		/
页数	文件大小	规格书
10页	194K
描述
ULTRA HIGH SPEED 4K x 4 STATIC CMOS RAMS

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中文翻译

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数据手册

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P4C1681-12LMB 数据手册

P4C1681, P4C1682

ULTRA HIGH SPEED 4K x 4

STATIC CMOS RAMS

FEATURES

Fully TTL Compatible Inputs and Outputs

Full CMOS, 6T Cell

StandardPinout(JEDECApproved)

– 24-Pin 300 mil DIP

High Speed (Equal Access and Cycle Times)

– 12/15/20/25 ns (Commercial)

–20/25/35ns(Military)

– 24-Pin 300 mil SOIC

– 24-Pin 300 mil SOJ

Low Power Operation

– 24-Pin Solder Seal Flat Pack

– 28-Pin LCC (450 mil x 450 mil)

Single 5V ± 10%Power Supply

Separate Inputs and Outputs

– P4C1681 Input Data at Outputs during Write

– P4C1682 Outputs in High Z during Write

DESCRIPTION

Access times as fast as 12 nanoseconds are available,

permitting greatly enhanced system operating speeds.

The P4C1681 and P4C1682are16,384-bit(4Kx4)ultra

high speed static RAMs similar to theP4C168,but with

separate data I/O pins. The P4C1681 features a

transparent write operation; the outputs of the P4C1682

are in high impedance during the write cycle. All devices

have low power standby modes. The RAMs operate

from a single 5V ± 10% tolerance power supply.

CMOS is used to reduce power consumption.

TheP4C1681andP4C1682areavailablein24-pin300mil

DIP, SOIC, SolderSealFlatpack, andSOJpackages, as

well as a 28-pin LCC package, providing excellent board

leveldensities.

FUNCTIONALBLOCKDIAGRAM

PINCONFIGURATIONS

LCC (L5-1)

DIP (P4,C4), SOIC (S4), SOJ (J4)

SOLDER SEAL FLAT PACK (FS-1)

Document # SRAM109 REV A

Revised October 2005

12 3 4 5 6 7...10

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与P4C1681-12LMB相关器件

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