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P4C1024-55C6M PDF预览

P4C1024-55C6M

更新时间: 2024-01-10 09:35:08
品牌 Logo 应用领域
PYRAMID 静态存储器内存集成电路
页数 文件大小 规格书
14页 923K
描述
Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32

P4C1024-55C6M 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:DIP
包装说明:DIP,针数:32
Reach Compliance Code:compliantECCN代码:3A001.A.2.C
HTS代码:8542.32.00.41风险等级:5.09
最长访问时间:55 nsJESD-30 代码:R-CDIP-T32
JESD-609代码:e0内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端子数量:32
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:128KX8
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:5.715 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:15.24 mm

P4C1024-55C6M 数据手册

 浏览型号P4C1024-55C6M的Datasheet PDF文件第2页浏览型号P4C1024-55C6M的Datasheet PDF文件第3页浏览型号P4C1024-55C6M的Datasheet PDF文件第4页浏览型号P4C1024-55C6M的Datasheet PDF文件第5页浏览型号P4C1024-55C6M的Datasheet PDF文件第6页浏览型号P4C1024-55C6M的Datasheet PDF文件第7页 
P4C1024  
HIGH SPEED 128K x 8  
DUAL CHIP ENABLE  
CMOS STATIC RAM  
FEATURES  
Fast tOE  
Automatic Power Down  
Packages  
—32-Pin 300 mil DIP and SOJ  
—32-Pin 400 mil SOJ  
—32-Pin 600 mil Ceramic DIP  
—32-Pin 400 mil Ceramic DIP  
—32-Pin Solder Seal Flatpack  
—32-Pin LCC (450 x 550 mil)  
—32-Pin LCC (400 x 820 mil) [Two-Sided]  
—32-Pin Ceramic SOJ  
High Speed (Equal Access and Cycle Times)  
— 15/20/25/35 ns (Commercial/Industrial)  
— 20/25/35/45/55/70/85/100/120 ns (Military)  
Single 5 Volts ±10% Power Supply  
Easy Memory Expansion Using CE1, CE2 and OE  
Inputs  
Common Data I/O  
Three-State Outputs  
Fully TTL Compatible Inputs and Outputs  
Advanced CMOS Technology  
DESCRIPTION  
The P4C1024 device provides asynchronous operations  
with matching access and cycle times. Memory loca-  
tions are specified on address pins A0 to A16. Reading  
is accomplished by device selection (CE1 low and CE2  
high) and output enabling (OE) while write enable (WE)  
remains HIGH. By presenting the address under these  
conditions, the data in the addressed memory location  
is presented on the data input/output pins. The input/  
output pins stay in the HIGH Z state when either CE1 or  
OE is HIGH or WE or CE2 is LOW.  
The P4C1024 is a 1,048,576-bit high-speed CMOS  
static RAM organized as 128Kx8. The CMOS memory  
requires no clocks or refreshing, and has equal access  
and cycle times. Inputs are fully TTL-compatible. The  
RAM operates from a single 5V±10% tolerance power  
supply.  
Access times of 15 nanoseconds permit greatly en-  
hanced system operating speeds. CMOS is utilized to  
reduce power consumption to a low level. The P4C1024  
is a member of a family of PACE RAM™ products offer-  
ing fast access times.  
PIN CONFIGURATION  
FUNCTIONAL BLOCK DIAGRAM  
DIP (P300, C10, C11),  
SOJ (J300, J400, CJ1),  
LCC (L1),  
SOLDER SEAL  
LCC (L6)  
FLATPACK (FS-3) SIMILAR  
Document # SRAM124 REV C  
Revised December 2011  

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