OPA356-Q1
www.ti.com .................................................................................................................................................................................................. SBOS479–MARCH 2009
200-MHz CMOS OPERATIONAL AMPLIFIER
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FEATURES
APPLICATIONS
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Video Processing
Ultrasound
Optical Networking, Tunable Lasers
Photodiode Transimpedance Amplifiers
Active Filters
High-Speed Integrators
Analog-To-Digital (A/D) Converter Input
Buffers
Digital-To-Analog (D/A) Converter Output
Amplifiers
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Qualified For Automotive Applications
Unity-Gain Bandwidth: 450 MHz
Wide Bandwidth: 200 MHz GBW
High Slew Rate: 360 V/s
Low Noise: 5.8 nV/√Hz
Excellent Video Performance
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Differential Gain: 0.02%
Differential Phase: 0.05°
0.1-dB Gain Flatness: 75 MHz
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Barcode Scanners
Communications
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Input Range Includes Ground
Rail-To-Rail Output (Within 100 mV)
Low Input Bias Current: 3 pA
Thermal Shutdown
Single-Supply Operating Range: 2.5 V To 5.5 V
DESCRIPTION
The OPA356 is a high-speed voltage-feedback CMOS operational amplifier designed for video and other
applications requiring wide bandwidth. The OPA356 is unity gain stable and can drive large output currents.
Differential gain is 0.02% and differential phase is 0.05°. Quiescent current is only 8.3 mA.
OPA356 is optimized for operation on single or dual supplies as low as 2.5 V (±1.25 V) and up to 5.5 V
(±2.75 V). Common-mode input range for the OPA356 extends 100 mV below ground and up to 1.5 V from V+.
The output swing is within 100 mV of the rails, supporting wide dynamic range.
The OPA356 is available in the SOT23-5 package and is specified over the –40°C to 125°C range.
DBV PACKAGE
(TOP VIEW)
V+
–VIN
Out
V–
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2
3
5
4
V+
Out
OPA356
+VIN
+In
–In
V–
ORDERING INFORMATION(1)
TA
–40°C to 125°C
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SOT-23 – DBV
Reel of 3000
OPA356AQDBVRQ1
OOVQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.