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OPA333AMDCKREP PDF预览

OPA333AMDCKREP

更新时间: 2024-11-25 04:35:43
品牌 Logo 应用领域
德州仪器 - TI 运算放大器
页数 文件大小 规格书
19页 611K
描述
1.8-V MICROPOWER CMOS OPERATIONAL AMPLIFIERS ZERO-DRIFT SERIES

OPA333AMDCKREP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:TSSOP, TSSOP5/6,.08针数:5
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:6 weeks
风险等级:1.16放大器类型:OPERATIONAL AMPLIFIER
架构:VOLTAGE-FEEDBACK最大平均偏置电流 (IIB):0.0002 µA
25C 时的最大偏置电流 (IIB):0.0002 µA最小共模抑制比:102 dB
标称共模抑制比:130 dB频率补偿:YES
最大输入失调电流 (IIO):0.0004 µA最大输入失调电压:10 µV
JESD-30 代码:R-PDSO-G5JESD-609代码:e4
长度:2 mm低-偏置:YES
低-失调:YES微功率:YES
湿度敏感等级:1功能数量:1
端子数量:5最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP5/6,.08
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TR峰值回流温度(摄氏度):260
功率:NO电源:+-0.9/+-2.75/1.8/5.5 V
可编程功率:NO认证状态:Not Qualified
座面最大高度:1.1 mm标称压摆率:0.16 V/us
子类别:Operational Amplifier最大压摆率:0.025 mA
供电电压上限:7 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
标称均一增益带宽:350 kHz最小电压增益:158000
宽带:NO宽度:1.25 mm
Base Number Matches:1

OPA333AMDCKREP 数据手册

 浏览型号OPA333AMDCKREP的Datasheet PDF文件第2页浏览型号OPA333AMDCKREP的Datasheet PDF文件第3页浏览型号OPA333AMDCKREP的Datasheet PDF文件第4页浏览型号OPA333AMDCKREP的Datasheet PDF文件第5页浏览型号OPA333AMDCKREP的Datasheet PDF文件第6页浏览型号OPA333AMDCKREP的Datasheet PDF文件第7页 
OPA333A-EP, OPA2333A-EP  
www.ti.com ............................................................................................................................................................ SGLS383BAPRIL 2007REVISED JUNE 2008  
1.8-V MICROPOWER CMOS OPERATIONAL AMPLIFIERS  
ZERO-DRIFT SERIES  
1
FEATURES  
Low Offset Voltage: 23 µV (Max)  
0.01-Hz to 10-Hz Noise: 1.1 µVPP  
Quiescent Current: 17 µA  
SUPPORTS DEFENSE, AEROSPACE,  
AND MEDICAL APPLICATIONS  
Controlled Baseline  
One Assembly/Test Site  
One Fabrication Site  
Available in Military (–55°C/125°C)  
Temperature Range(1)  
Single-Supply Operation  
Supply Voltage: 1.8 V to 5.5 V  
Rail-to-Rail Input/Output  
MicroSize Packages: SC70 and SOT23  
Extended Product Life Cycle  
Extended Product-Change Notification  
Product Traceability  
APPLICATIONS  
Transducer Applications  
Temperature Measurements  
Electronic Scales  
Medical Instrumentation  
Battery-Powered Instruments  
Handheld Test Equipment  
(1) Custom temperature ranges available  
DCK PACKAGE  
(TOP VIEW)  
D PACKAGE  
(TOP VIEW)  
DBV PACKAGE  
(TOP VIEW)  
+IN  
V  
V+  
1
2
3
5
4
OUT  
V–  
V+  
1
2
3
5
4
OUT A  
IN A  
+IN A  
V–  
V+  
1
2
3
4
8
7
6
5
OUT B  
IN B  
+IN B  
IN  
OUT  
+IN  
IN  
0.1Hz TO 10Hz NOISE  
1s/div  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2007–2008, Texas Instruments Incorporated  

OPA333AMDCKREP 替代型号

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OPA333AIDCKR TI

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