NTUD3171PZ
Small Signal MOSFET
−20 V, −200 mA, Dual P−Channel,
1.0 x 1.0 mm SOT−963 Package
Features
http://onsemi.com
• Dual P−Channel MOSFET
• Offers a Low R
Solution in the Ultra Small 1.0 x 1.0 mm
DS(on)
V
R
MAX
I Max
D
(BR)DSS
DS(ON)
Package
5.0 W @ −4.5 V
6.0 W @ −2.5 V
• 1.5 V Gate Voltage Rating
• Ultra Thin Profile (< 0.5 mm) Allows It to Fit Easily into Extremely
Thin Environments such as Portable Electronics.
• This is a Pb−Free Device
−20 V
−0.2 A
7.0 W @ −1.8 V
10 W @ −1.5 V
D1
D2
Applications
• High Side Switch
• High Speed Interfacing
• Optimized for Power Management in Ultra Portable Equipment
G1
G2
MAXIMUM RATINGS (T = 25°C unless otherwise specified)
J
P−Channel
MOSFET
Parameter
Drain−to−Source Voltage
Symbol Value Unit
S1
S2
V
DSS
−20
8
V
V
Gate−to−Source Voltage
V
GS
PINOUT: SOT−963
Continuous Drain
Current (Note 1)
T = 25°C
−200
−140
−250
−125
A
Steady
State
T = 85°C
A
I
mA
D
S
1
2
3
6
5
D
1
1
t v 5 s
T = 25°C
A
Power Dissipation
(Note 1)
Steady
State
G
G
2
T = 25°C
A
P
mW
1
D
t v 5 s
−200
−600
Pulsed Drain Current
t = 10 ms
p
I
mA
DM
4
S
2
D
2
Operating Junction and Storage Temperature
T ,
STG
−55 to
150
°C
J
T
Source Current (Body Diode) (Note 2)
I
S
−200
mA
Top View
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
260
°C
T
L
MARKING
DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using the minimum recommended pad size,
1 oz Cu.
SOT−963
CASE 527AD
4 M G
1
2. Pulse Test: pulse width v300 ms, duty cycle v2%
4
= Specific Device Code
M
G
= Date Code
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
August, 2008 − Rev. 0
NTUD3171PZ/D