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NTL04B9N1TRF PDF预览

NTL04B9N1TRF

更新时间: 2024-11-30 20:38:07
品牌 Logo 应用领域
尼吉康 - NICHICON 大电流电感器测试
页数 文件大小 规格书
4页 165K
描述
General Purpose Inductor, 0.0091uH, 1.099%, 1 Element, Alumina-Core, SMD, 0402, CHIP, 0402, ROHS COMPLIANT

NTL04B9N1TRF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:0402
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.50.80.00风险等级:5.84
大小写代码:0402构造:Chip
型芯材料:ALUMINA直流电阻:1.3 Ω
标称电感 (L):0.0091 µH电感器应用:HIGH CURRENT INDUCTOR
电感器类型:GENERAL PURPOSE INDUCTORJESD-609代码:e3
功能数量:1端子数量:2
最高工作温度:125 °C最低工作温度:-40 °C
封装高度:0.4 mm封装长度:1 mm
封装形式:SMT封装宽度:0.5 mm
包装方法:TR最小质量因数(标称电感时):10
最大额定电流:0.31 A自谐振频率:3500 MHz
形状/尺寸说明:RECTANGULAR PACKAGE屏蔽:NO
特殊特征:INDUCTANCE TOLERANCE IS 0.1 NANO HENRY表面贴装:YES
端子面层:Tin (Sn)端子位置:DUAL ENDED
端子形状:WRAPAROUND测试频率:300 MHz
容差:1.099%Base Number Matches:1

NTL04B9N1TRF 数据手册

 浏览型号NTL04B9N1TRF的Datasheet PDF文件第2页浏览型号NTL04B9N1TRF的Datasheet PDF文件第3页浏览型号NTL04B9N1TRF的Datasheet PDF文件第4页 
NTL Series  
Thin Film Chip Inductors  
FEATURES  
• ULTRA-SMALL LOW PROFILE 0201, 0402 & 0603SIZES  
• HIGH Q (15 ~ 40) @ 300MHz ~ 1.5GHz  
• S-PARAMETER CHARACTERISTICS AVAILABLE  
• HIGH CURRENT & HIGH SRF  
RoHS  
Compliant  
includes all homogeneous materials  
• COMPATIBLE WITH Pb-FREE SOLDERING  
• RoHS COMPLIANT  
*See Part Number System for Details  
CHARACTERISTICS  
0201  
0402  
0603*  
Case Size  
1.0nH ~ 5.6nH  
1.0nH ~ 15nH  
1.0nH ~ 100nH  
Inductance Range  
Available Tolerance  
Temperature Range  
Resistance to Solder Heat  
Temperature Cycling  
±0.1nH (B), ±0.2nH (C) & 2% (G)  
-40°C ~ +125°C  
±0.2nH (C) & 2% (G)  
270°C ±5°C for 10 seconds  
ΔL±10% after 10 cycles -40°C/+20°C/+85°C/+20°C  
*Not recommended for new designs (see NTI06 series)  
CONSTRUCTION  
PART NUMBER SYSTEM  
NTL 02 C 33N TR F  
RoHS compliant  
Tape & Reel Packaging  
Inductance Value in nano-henries,  
"N" indicates decimal point  
Inductance Tolerance (see values tables)  
Case Code  
Copper (Cu)  
Termination Base  
Series  
2µm Nickel (Ni) Barrier  
3µm Tin (Sn) Outerplating  
CASE DIMENSIONS (mm)  
Case Sixe  
0201  
L
W
T
P
Alumina Substrate  
Etched Copper Coil  
0.61 ± 0.05 0.31 ± 0.05 0.28 ± 0.05 0.12 ± 0.05  
0402  
1.0 ± 0.10  
1.6 ± 0.10  
0.5 ± 0.10 0.40 ± 0.10 0.25 ± 0.10  
0.8 ± 0.10 0.45 ± 0.10 0.30 ± 0.10  
T
0603  
LAND PATTERN DIMENSIONS (mm)  
W
P
Case Sixe  
0201  
A
B
C
D
0.2 ~ 0.3  
0.5 ~ 0.6  
0.6 ~ 1.0  
0.8 ~ 0.9  
1.5 ~ 1.8  
2.4 ~ 2.8  
0.2 ~ 0.3  
0.5 ~ 0.6  
0.7 ~ 0.9  
0.3 ~ 0.4  
0.5 ~ 0.6  
0.9 ~ 1.1  
L
0402  
0603  
REFLOW SOLDERING PROFILE  
10 sec. max.  
250°C max.  
220°C  
250°C  
A
200°C  
150°C  
100°C  
50°C  
130°C ~ 180°C  
C
B
D
Time above 220°C -  
30 ~ 90 sec. max.  
60 ~ 90 sec.  
Time (seconds)  
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com  
15  

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