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NTD4813N-1G PDF预览

NTD4813N-1G

更新时间: 2024-11-18 06:00:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 303K
描述
Power MOSFET 30 V, 40 A, Single N--Channel, DPAK/IPAK

NTD4813N-1G 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:LEAD FREE, CASE 369D-01, IPAK-3针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.25雪崩能效等级(Eas):72 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):7.6 A
最大漏源导通电阻:0.024 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):90 A
认证状态:Not Qualified表面贴装:NO
端子面层:Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTD4813N-1G 数据手册

 浏览型号NTD4813N-1G的Datasheet PDF文件第2页浏览型号NTD4813N-1G的Datasheet PDF文件第3页浏览型号NTD4813N-1G的Datasheet PDF文件第4页浏览型号NTD4813N-1G的Datasheet PDF文件第5页浏览型号NTD4813N-1G的Datasheet PDF文件第6页浏览型号NTD4813N-1G的Datasheet PDF文件第7页 
NTD4813N  
Power MOSFET  
30 V, 40 A, Single N--Channel, DPAK/IPAK  
Features  
Low RDS(on) to Minimize Conduction Losses  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
These are Pb--Free Devices  
http://onsemi.com  
V
R
MAX  
I
MAX  
D
(BR)DSS  
DS(ON)  
Applications  
13 mΩ @ 10 V  
24 mΩ @ 4.5 V  
CPU Power Delivery  
DC--DC Converters  
High Side Switching  
30 V  
40 A  
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain--to--Source Voltage  
Gate--to--Source Voltage  
Symbol  
Value  
30  
Unit  
G
V
V
V
A
DSS  
V
±20  
9.0  
GS  
S
Continuous Drain  
Current R  
I
D
T
= 25°C  
= 85°C  
= 25°C  
A
N--CHANNEL MOSFET  
θ
JA  
T
A
7.0  
(Note 1)  
Power Dissipation  
(Note 1)  
4
T
A
P
1.94  
W
A
4
D
R
θ
JA  
4
Continuous Drain  
ID  
T
A
= 25°C  
= 85°C  
= 25°C  
7.6  
5.9  
Current R  
(Note 2)  
θ
JA  
T
A
Steady  
State  
2
1
1
1
2
3
3
Power Dissipation  
(Note 2)  
T
A
P
I
1.27  
W
A
2
D
3
R
θ
JA  
CASE 369AC  
3 IPAK  
(Straight Lead)  
CASE 369AA  
DPAK  
(Bent Lead)  
STYLE 2  
CASE 369D  
IPAK  
(Straight Lead  
DPAK)  
Continuous Drain  
T
C
T
C
T
C
= 25°C  
= 85°C  
= 25°C  
40  
31  
D
Current R  
(Note 1)  
θ
JC  
Power Dissipation  
(Note 1)  
P
35.3  
W
A
D
R
θ
JC  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Pulsed Drain  
Current  
t =10ms  
p
T
A
= 25°C  
= 25°C  
I
DM  
90  
35  
4
Current Limited by Package  
T
A
I
A
DmaxPkg  
Drain  
4
4
Operating Junction and Storage  
Temperature  
T ,  
-- 5 5 t o  
+175  
°C  
J
Drain  
Drain  
T
STG  
Source Current (Body Diode)  
Drain to Source dV/dt  
I
29  
6
A
S
dV/dt  
EAS  
V/ns  
mJ  
Single Pulse Drain--to--Source Avalanche  
Energy (V = 24 V, V = 10 V,  
72  
DD  
GS  
I = 12 A , L = 1.0 mH, R = 25 Ω)  
2
L
pk  
G
1
2
3
Drain  
1
3
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
°C  
L
Gate Drain Source  
Gate Source  
1
2
3
Gate Drain Source  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Y
WW  
= Year  
= Work Week  
4813N = Device Code  
= Pb--Free Package  
G
ORDERING INFORMATION  
Seedetailedorderingandshippinginformationinthepackage  
dimensions section on page 6 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
June, 2010 -- Rev. 6  
NTD4813N/D  

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