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NTCG064QH334JT PDF预览

NTCG064QH334JT

更新时间: 2023-02-26 14:18:26
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
8页 371K
描述
NTC Thermistor, 330000ohm, Surface Mount, CHIP, 0201, LEAD FREE

NTCG064QH334JT 数据手册

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(1/8)  
007-01 / 20030409 / eb221_ntcg.
NTCG Series(SMD, Pb Free)  
NTCG06/10/16/20 Types  
Sensors  
Temperature Sensors  
NTC Thermistors  
FEATURES  
• Small sized 0603 type (L0.6×W0.3×T0.3mm) series are available.  
• Lead (Pb) free product.  
By using lead-less terminal electrodes and electroplating (Ni-Sn), this product realized excellent solderablity and soldering heat  
resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).  
• Good solderability.  
• Layered internal electrode structure.  
• Product series provides a wide range of resistances and B constants.  
• Good stability of resistance value after soldering.  
• The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics.  
• Attains less that low floating capacitance (using TCXO) in the high frequency region.  
APPLICATIONS  
• Equipment related to mobile communication  
TCXOs (temperature compensated type quartz oscillator), RF circuits (power amp circuits, temperature monitoring circuits), LCD panel  
temperature compensation circuits, battery pack temperature compensation circuits  
• Computer related equipment  
CPU periphery temperature monitoring circuits, optical pickup temperature compensated circuit, temperature compensated circuit in  
HDD  
• DVC/DSC devices  
Auto-focus circuits, plunger peripheral circuits, battery pack temperature control circuits  
• Equipment related to car audio  
Various types of pickup temperature compensation circuits, temperature compensation for various types of circuits  
• Optical communication related equipment  
Laser transmission circuit temperature compensation  
SHAPES AND DIMENSIONS  
STRUCTURAL DIAGRAM  
L
Sn Pd NTC  
Ni  
Ag  
B
Electrode material  
Internal:Pd  
External:Ag/Ni/Sn  
Dimensionsin mm  
Type  
0603  
1005  
1608  
2012  
L
W
T
B
0.6 0.03  
1 0.05  
1.6 0.1  
2 0.2  
0.3 0.03  
0.5 0.05  
0.8 0.1  
1.25 0.2  
0.3 0.03  
0.5 0.05  
0.8 0.1  
0.7 0.2  
0.1 min.  
0.15 min.  
0.2 min.  
0.2 min.  
RECOMMENDED PC BOARD PATTERN  
RECOMMENDED REFLOW SOLDERING CONDITIONS  
a
250  
200  
150  
100  
50  
2
3
2
3
T
a
T
W b W  
Over 60s  
Over 60s  
20s max.  
• All specifications are subject to change without notice.  

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