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NSRLL30XV2T1G PDF预览

NSRLL30XV2T1G

更新时间: 2024-11-18 07:03:27
品牌 Logo 应用领域
安森美 - ONSEMI 整流二极管肖特基二极管测试光电二极管快速恢复二极管
页数 文件大小 规格书
3页 50K
描述
Schottky Barrier Diode

NSRLL30XV2T1G 技术参数

是否无铅:不含铅生命周期:Active
包装说明:R-PDSO-F2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.70Factory Lead Time:1 week
风险等级:1.23Is Samacsys:N
应用:FAST RECOVERY配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.6 VJESD-30 代码:R-PDSO-F2
JESD-609代码:e3湿度敏感等级:1
最大非重复峰值正向电流:0.6 A元件数量:1
相数:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
最大输出电流:0.2 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED最大功率耗散:0.2 W
认证状态:Not Qualified最大重复峰值反向电压:30 V
最大反向电流:1 µA反向测试电压:10 V
子类别:Rectifier Diodes表面贴装:YES
技术:SCHOTTKY端子面层:Tin (Sn)
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

NSRLL30XV2T1G 数据手册

 浏览型号NSRLL30XV2T1G的Datasheet PDF文件第2页浏览型号NSRLL30XV2T1G的Datasheet PDF文件第3页 
NSRLL30XV2T1G  
Schottky Barrier Diode  
These Schottky barrier diodes are designed for high−speed  
switching applications, circuit protection, and voltage clamping.  
Extremely low forward voltage reduces conduction loss. Miniature  
surface mount package is excellent for hand−held and portable  
applications where space is limited.  
http://onsemi.com  
Features  
Extremely Fast Switching Speed  
30 VOLT SCHOTTKY  
BARRIER DIODE  
Extremely Low Forward Voltage 0.6 V (max) @ I = 200 mA  
F
Low Reverse Current  
ESD Rating: Class 3B per Human Body Model  
Class C per Machine Model  
This is a Pb−Free Device  
1
2
CATHODE  
ANODE  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
30  
Unit  
V
2
Reverse Voltage  
Forward Current DC  
V
R
1
I
F
200  
mA  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
SOD−523  
CASE 502  
PLASTIC  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Total Device Dissipation FR−5 Board,  
P
200  
mW  
MARKING DIAGRAM  
D
(Note 1) T = 25°C  
A
Derate above 25°C  
1.57  
635  
mW/°C  
°C/W  
°C  
Thermal Resistance, Junction−to−Ambient  
R
JA  
RT MG  
G
Junction and Storage Temperature Range T , T  
−55 to +150  
J
stg  
1
2
1. FR−5 Minimum Pad.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
RT = Device Code  
Characteristic  
Symbol Min Typ Max Unit  
M
= Date Code*  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
Reverse Leakage  
I
R
1.0  
A
(V = 10 V)  
R
*Date Code orientation position may vary depending  
upon manufacturing location.  
Forward Voltage  
V
F
0.60  
V
(I = 200 mA)  
F
ORDERING INFORMATION  
Device  
Package  
Shipping  
NSRLL30XV2T1G SOD−523* 3000/Tape & Reel  
*This package is inherently Pb−Free.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
August, 2006 − Rev. 0  
NSRLL30XV2/D  
 

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