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NSP2201MR6T1G

更新时间： 2024-11-23 21:12:15
品牌 Logo 应用领域
安森美 - ONSEMI 局域网测试光电二极管
页数 文件大小 规格书
8页 261K
描述
Trans Voltage Suppressor Diode

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中文翻译

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NSP2201MR6T1G 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：TSOP-6Reach Compliance Code：compliant
风险等级：5.8最小击穿电压：6 V
最大钳位电压：12 V配置：SINGLE
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：R-PDSO-G6最大非重复峰值反向功率耗散：500 W
元件数量：1端子数量：6
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：NOT SPECIFIED
极性：UNIDIRECTIONAL参考标准：IEC-61000-4-2, 4-4, 4-5
最大重复峰值反向电压：5 V最大反向电流：1 µA
反向测试电压：5 V表面贴装：YES
技术：AVALANCHE端子形式：GULL WING
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

NSP2201MR6T1G 数据手册

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NSP2201MR6  
ESD and Surge Protection  
Device  
Low Clamping Voltage Surge Protection  
Diode Array  
www.onsemi.com  
The NSP2201MR6 surge protector is designed to protect high speed  
data lines from ESD, EFT, and lightning surges.  
6
Features  
• Protection for the Following IEC Standards:  
IEC 61000−4−2 (ESD) 30 kV (Contact)  
IEC 61000−4−5 (Lightning) 25 A (8/20 ms)  
• Low Clamping Voltage  
1
TSOP−6  
CASE 318G  
• Low Leakage  
• UL Flammability Rating of 94 V−0  
MARKING DIAGRAM  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
22 MG  
G
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
22 = Specific Device Code  
M = Date Code  
Typical Applications  
G
= Pb−Free Package  
• High Speed Communication Line Protection  
• USB 1.1 and 2.0 Power and Data Line Protection  
• Digital Video Interface (DVI)  
(Note: Microdot may be in either location)  
*Date Code orientation may vary  
depending upon manufacturing location.  
• Monitors and Flat Panel Displays  
PIN CONFIGURATION AND SCHEMATIC  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
Unit  
I/O 1  
6 I/O  
Peak Power Dissipation  
P
pk  
500  
W
8/20 ms @ T = 25°C (Note 1)  
A
V
2
5 V  
P
N
Operating Junction Temperature Range  
Storage Temperature Range  
T
−40 to +125  
−55 to +150  
260  
°C  
°C  
°C  
J
T
stg  
N/C 3  
4 N/C  
Lead Solder Temperature −  
Maximum (10 Seconds)  
T
L
IEC 61000−4−2 Air (ESD)  
IEC 61000−4−2 Contact (ESD)  
ESD  
30  
30  
kV  
ORDERING INFORMATION  
IEC 61000−4−4 (5/50 ns)  
EFT  
40  
A
Device  
Package  
Shipping  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
NSP2201MR6T1G  
TSOP−6  
(Pb−Free)  
3000 / Tape &  
Reel  
1. Non−repetitive current pulse per Figure 1 (Pin 5 to Pin 2)  
SZNSP2201MR6T1G TSOP−6  
(Pb−Free)  
3000 / Tape &  
Reel  
See Application Note AND8308/D for further description of  
survivability specs.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
July, 2019 − Rev. 0  
NSP2201MR6/D  
 
12345678

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