MURA160T3
Preferred Device
Surface Mount
Ultrafast Power Rectifier
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
http://onsemi.com
Features
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
ULTRAFAST RECTIFIER
1 AMPERE, 600 VOLTS
• High Temperature Glass Passivated Junction
• Low Forward Voltage Drop (1.05 V Max @ 1.0 A, T = 150°C)
J
• Pb−Free Package is Available
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
SMA
CASE 403D
PLASTIC
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Polarity Band Indicates Cathode Lead
MARKING DIAGRAM
• ESD Protection: Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
U4J
AYWW G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
600
V
RRM
RWM
R
V
V
U4J = Device Code
Average Rectified Forward Current
I
A
A
F(AV)
A
Y
= Assembly Location
= Year
@ T = 145°C
1.0
2.0
L
@ T = 110°C
L
WW = Work Week
G
= Pb−Free Package
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single Phase,
60 Hz)
I
30
FSM
ORDERING INFORMATION
Operating Junction Temperature Range
T
−65 to +175
°C
†
J
Device
Package
Shipping
THERMAL CHARACTERISTICS
Characteristic
MURA160T3
SMA
5000/Tape & Reel
5000/Tape & Reel
Symbol
Max
Unit
MURA160T3G
SMA
(Pb−Free)
Thermal Resistance, Junction−to−Lead
Psi
24
°C/W
JL
(T = 25°C) (Note 1)
(Note 2)
R
L
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Thermal Resistance, Junction−to−Ambient
(Note 1)
216
q
JA
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Preferred devices are recommended choices for future use
and best overall value.
1. Rating applies when surface mounted on the minimum pad size
recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by R
)
q
JL
are now referenced as Psi
.
JL
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 4
MURA160T3/D