NP276-40009-X

更新时间： 2024-11-24 13:12:03

品牌	Logo	应用领域
YAMAICHI		插座插槽和芯片载体栅 PC
页数	文件大小	规格书
11页	725K
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中文翻译

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数据手册

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NP276-40009-X 数据手册

NP276 Series (Open Top)

Ball Grid Array (BGA, 1.27mm Pitch)

Specifications

Part Number(Details)

1,000M min. at 100V DC

Dielectric Withstanding Voltage:100V AC for 1 minute

Insulation Resistance:

NP276

Series No.

1105 22

(*)

Contact Resistance:

30m max. at 10mA/20mV max.

Operating Temperature Range: –55°C to +150°C

–40°C to +170°C

No. of Contact Pins

(.AC-types are depopulated

base sockets)

Contact Force:

Mating Cycles:

30g per pin approx.

10,000 insetions

Design Number

Materials and Finish

Housing:

Polyetherimide (PEI), glass-filled

Positioning Pin Options (see PCB):

Polyethersulphone (PES), glass-filled

Pos. pin 'A'

With

Without

Pos. pin 'B'

With

Without

With

Contacts:

Plating:

Beryllium Copper (BeCu)

Gold over Nickel

1 =

2 =

3 =

4 =

Features

Without

í Open top type sockets for BGA packages

í Self contacting structure without upper pressing force (ZIF)

í Contacting structure to nip the sides of solder balls to lower

damage to the coplanarity of the solder balls

Contact Terminal Length and Form

Yamaichi's 2-point Tweezer Contact

Ball

Socket

Base A

Since the solder balls are touched

by two contacts on each side,

the solder ball damage can be

minimized; additional features

are low actuation force and

compact socket size

Contacts

Socket

Base B

We have depopulated versions from existing NP276 base sockets.

As new versions are continually being tooled up we rcommend

to contact Yamaichi for your specific pin count

and matching IC

Applicable Base Socket and IC Dimensions

IC Dimensions

Body Size

Grid Size

Base Sockets

Part

Number

Count

(see page)

Pitch

NP276-11904

NP276-11904-3

NP276-15316

NP276-16951

NP276-25626

NP276-37206

119

153

169

256

372

1.27

7 x 17

14 x 22

17 x 17

21 x 21

27 x 27

9 x 17

13 x 13

16 x 16

20 x 20

NP276-40009

NP276-59608

400

596

1.27

20 x 20

26 x 26

27 x 27

35 x 35

NP276-65227

NP276-87318

NP276-110522

652

873

1.27

28 x 28

31 x 31

35 x 35

37.5 x 37.5

40 x 40

1105

45 x 45

Test & Burn-In

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE

–

DIMENSIONS IN MILLIMETER

12 3 4 5 6 7...11

中文翻译

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与NP276-40009-X相关器件

型号	品牌	获取价格	描述	数据表
NP276-52928-B	YAMAICHI	获取价格	IC Socket, BGA529, 529 Contact(s), Solder
NP276-52928-BX	YAMAICHI	获取价格	IC Socket, BGA529, 529 Contact(s)
NP276-52929-AC12409	YAMAICHI	获取价格	IC Socket, BGA304, 304 Contact(s), Solder
NP276-59608	YAMAICHI	获取价格	Ball Grid Array (BGA, 1.27mm Pitch)
NP276-59608-A	YAMAICHI	获取价格	IC Socket, BGA596, 596 Contact(s), Solder
NP276-59608-AC03035	YAMAICHI	获取价格	IC Socket, BGA484, 484 Contact(s), Solder
NP276-59608-AC03137	YAMAICHI	获取价格	IC Socket, BGA388, 388 Contact(s), Solder
NP276-59608-AC03142	YAMAICHI	获取价格	IC Socket, BGA480, 480 Contact(s), Solder
NP276-59608-AC03146	YAMAICHI	获取价格	IC Socket, BGA352, 352 Contact(s), Solder
NP276-59608-AC03149	YAMAICHI	获取价格	IC Socket, BGA356, 356 Contact(s), Solder

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