生命周期: | Contact Manufacturer | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8536.69.40.40 |
风险等级: | 5.69 | Is Samacsys: | N |
设备插槽类型: | IC SOCKET | 使用的设备类型: | BGA110 |
外壳材料: | POLYETHERIMIDE | 触点数: | 110 |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
NP276-11904 | YAMAICHI | Ball Grid Array (BGA, 1.27mm Pitch) |
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NP276-11904-2 | YAMAICHI | IC Socket, BGA119, 119 Contact(s) |
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NP276-11904-3 | YAMAICHI | Ball Grid Array (BGA, 1.27mm Pitch) |
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NP276-11904-X | YAMAICHI | IC Socket, BGA119, 119 Contact(s) |
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NP276-11935 | YAMAICHI | IC Socket, BGA119, 119 Contact(s), Solder |
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NP276-15316 | YAMAICHI | Ball Grid Array (BGA, 1.27mm Pitch) |
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NP276-15334 | YAMAICHI | IC Socket, BGA153, 153 Contact(s), Solder |
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NP276-15334-A | YAMAICHI | IC Socket, BGA153, 153 Contact(s) |
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NP276-15334-X | YAMAICHI | IC Socket, BGA153, 153 Contact(s) |
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NP276-16951 | YAMAICHI | Ball Grid Array (BGA, 1.27mm Pitch) |
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NP276-25626 | YAMAICHI | Ball Grid Array (BGA, 1.27mm Pitch) |
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NP276-25626-A | YAMAICHI | 暂无描述 |
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NP276-25626-AC06672 | YAMAICHI | IC Socket, BGA225, 225 Contact(s), Solder |
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NP276-25626-X | YAMAICHI | IC Socket, BGA256, 256 Contact(s) |
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NP276-37206 | YAMAICHI | Ball Grid Array (BGA, 1.27mm Pitch) |
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NP276-37206-A | YAMAICHI | IC Socket, BGA372, 372 Contact(s), Solder |
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NP276-37206-AC03134 | YAMAICHI | IC Socket, BGA272, 272 Contact(s), Solder |
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NP276-37206-AC03140 | YAMAICHI | IC Socket, BGA292, 292 Contact(s), Solder |
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NP276-37206-AC03143 | YAMAICHI | IC Socket, BGA144, 144 Contact(s), Solder |
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NP276-37206-AC03145 | YAMAICHI | IC Socket, BGA256, 256 Contact(s), Solder |
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