5秒后页面跳转
NP276-11935 PDF预览

NP276-11935

更新时间: 2023-02-15 00:00:00
品牌 Logo 应用领域
YAMAICHI /
页数 文件大小 规格书
2页 185K
描述
IC Socket, BGA119, 119 Contact(s), Solder

NP276-11935 数据手册

 浏览型号NP276-11935的Datasheet PDF文件第2页 
BGA  
NP276 Series  
Characteristics  
1,000M½ or more at 100 VDC  
NP276-372 06-A *  
Insulation Resistance:  
Withstanding Voltage:  
Contact Resistance:  
Operating Temperature:  
100 VAC for 1 Minute  
30m½ or less at 10mA/20mV (Initial)  
-55ûC ~ +150ûC  
Socket Series  
No. of Leads  
Design No.  
Material  
Insulator:  
Contact:  
Plating:  
PEI (Glass Filled) UL94V-0  
Beryllium Copper  
Gold over Nickel  
Positioning Pin Identification  
Depopulated Versions Available  
±
±
2 0  

与NP276-11935相关器件

型号 品牌 描述 获取价格 数据表
NP276-15316 YAMAICHI Ball Grid Array (BGA, 1.27mm Pitch)

获取价格

NP276-15334 YAMAICHI IC Socket, BGA153, 153 Contact(s), Solder

获取价格

NP276-15334-A YAMAICHI IC Socket, BGA153, 153 Contact(s)

获取价格

NP276-15334-X YAMAICHI IC Socket, BGA153, 153 Contact(s)

获取价格

NP276-16951 YAMAICHI Ball Grid Array (BGA, 1.27mm Pitch)

获取价格

NP276-25626 YAMAICHI Ball Grid Array (BGA, 1.27mm Pitch)

获取价格