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NP276-40009 PDF预览

NP276-40009

更新时间: 2024-11-24 06:00:55
品牌 Logo 应用领域
YAMAICHI 插座插槽和芯片载体PC
页数 文件大小 规格书
11页 725K
描述
Ball Grid Array (BGA, 1.27mm Pitch)

NP276-40009 技术参数

生命周期:Contact ManufacturerReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8536.69.40.40
风险等级:5.67Is Samacsys:N
其他特性:NO LATCH INCLUDED主体宽度:1.945 inch
主体深度:0.752 inch主体长度:1.945 inch
触点的结构:20X20联系完成配合:AU ON NI
触点材料:BE-CU触点样式:RND PIN-SKT
设备插槽类型:IC SOCKET使用的设备类型:BGA400
介电耐压:100VAC V外壳材料:POLYETHERIMIDE
绝缘电阻:1000000000 Ω插接触点节距:0.05 inch
安装方式:STRAIGHT触点数:400
最高工作温度:150 °C最低工作温度:-55 °C
PCB接触模式:RECTANGULAR端接类型:SOLDER
Base Number Matches:1

NP276-40009 数据手册

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NP276 Series (Open Top)  
Ball Grid Array (BGA, 1.27mm Pitch)  
Specifications  
Part Number(Details)  
W
1,000M min. at 100V DC  
Dielectric Withstanding Voltage:100V AC for 1 minute  
Insulation Resistance:  
-
NP276  
Series No.  
-
-
*
1105 22  
(*)  
W
Contact Resistance:  
30m max. at 10mA/20mV max.  
Operating Temperature Range: –55°C to +150°C  
–40°C to +170°C  
No. of Contact Pins  
(.AC-types are depopulated  
base sockets)  
Contact Force:  
Mating Cycles:  
30g per pin approx.  
10,000 insetions  
Design Number  
Materials and Finish  
Housing:  
Polyetherimide (PEI), glass-filled  
Positioning Pin Options (see PCB):  
Polyethersulphone (PES), glass-filled  
Pos. pin 'A'  
With  
With  
Without  
Without  
Pos. pin 'B'  
With  
Without  
With  
Contacts:  
Plating:  
Beryllium Copper (BeCu)  
Gold over Nickel  
1 =  
2 =  
3 =  
4 =  
Features  
Without  
í Open top type sockets for BGA packages  
í Self contacting structure without upper pressing force (ZIF)  
í Contacting structure to nip the sides of solder balls to lower  
damage to the coplanarity of the solder balls  
Contact Terminal Length and Form  
Yamaichi's 2-point Tweezer Contact  
IC  
Ball  
Socket  
Base A  
Since the solder balls are touched  
by two contacts on each side,  
the solder ball damage can be  
minimized; additional features  
are low actuation force and  
compact socket size  
Contacts  
Socket  
Base B  
We have depopulated versions from existing NP276 base sockets.  
As new versions are continually being tooled up we rcommend  
to contact Yamaichi for your specific pin count  
and matching IC  
Applicable Base Socket and IC Dimensions  
IC Dimensions  
Body Size  
Grid Size  
Base Sockets  
Part  
Number  
Pin  
Count  
(see page)  
Pitch  
NP276-11904  
NP276-11904-3  
NP276-15316  
NP276-16951  
NP276-25626  
NP276-37206  
119  
119  
153  
169  
256  
372  
1.27  
1.27  
1.27  
1.27  
1.27  
1.27  
7 x 17  
7 x 17  
14 x 22  
14 x 22  
14 x 22  
17 x 17  
21 x 21  
27 x 27  
2
2
3
4
5
6
9 x 17  
13 x 13  
16 x 16  
20 x 20  
NP276-40009  
NP276-59608  
400  
596  
1.27  
1.27  
20 x 20  
26 x 26  
27 x 27  
35 x 35  
7
8
NP276-65227  
NP276-87318  
NP276-110522  
652  
873  
1.27  
1.27  
1.27  
28 x 28  
31 x 31  
35 x 35  
37.5 x 37.5  
40 x 40  
9
10  
11  
1105  
45 x 45  
Test & Burn-In  
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE  
DIMENSIONS IN MILLIMETER  

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