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NM27LV010BTE300 PDF预览

NM27LV010BTE300

更新时间: 2024-01-03 20:21:48
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD OTP只读存储器光电二极管内存集成电路
页数 文件大小 规格书
10页 126K
描述
OTP ROM, 128KX8, 250ns, CMOS, PDSO32, 8 X 20 MM, TSOP-32

NM27LV010BTE300 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP包装说明:TSOP1, TSSOP32,.8,20
针数:32Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.71
风险等级:5.76Is Samacsys:N
最长访问时间:250 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-G32JESD-609代码:e0
长度:18.4 mm内存密度:1048576 bit
内存集成电路类型:OTP ROM内存宽度:8
功能数量:1端子数量:32
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:128KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP32,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3/3.3 V认证状态:Not Qualified
座面最大高度:1.2 mm最大待机电流:0.00005 A
子类别:OTP ROMs最大压摆率:0.015 mA
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:8 mm
Base Number Matches:1

NM27LV010BTE300 数据手册

 浏览型号NM27LV010BTE300的Datasheet PDF文件第2页浏览型号NM27LV010BTE300的Datasheet PDF文件第3页浏览型号NM27LV010BTE300的Datasheet PDF文件第4页浏览型号NM27LV010BTE300的Datasheet PDF文件第5页浏览型号NM27LV010BTE300的Datasheet PDF文件第6页浏览型号NM27LV010BTE300的Datasheet PDF文件第7页 
March 1997  
NM27LV010B  
1,048,576-Bit (128k x 8) Low Voltage EPROM  
tion runs, and TSOP for PC board sensitive users. The  
NM27LV010B is one member of Fairchild’s growing Low  
Voltage product family.  
General Description  
The NM27LV010B is a high performance Low Voltage Elec-  
trically Programmable Read Only Memory. It is manufac-  
tured using Fairchild’s latest 0.8µ CMOS split gate AMG  
Features  
EPROM technology. This technology allows the part to oper-  
ate at speeds as fast as 250 ns over industrial temperatures  
(−40˚C to +85˚C).  
n 2.7V to 3.6V operation  
n 250 ns access time  
n Low current operation  
This Low Voltage and Low Power EPROM is designed with  
power sensitive hand held and portable battery products in  
mind. This allows for code storage of firmware for applica-  
tions like notebook computers, palm top computers, cellular  
phones, and HDD.  
@
— 8 mA ICC Active Current 5 MHz (Typ)  
— 15 µA ICC Standby Current 5 MHz (Typ)  
n Ultra low power operation  
— 50 µW Standby Power 3.3V (Typ)  
@
@
@
— 27 mW Active Power 3.3V (Typ)  
Small outline packages are just as critical to portable appli-  
cations as Low Voltage and Low Power. Fairchild Semicon-  
ductor has foreseen this need and provides windowed LCC  
for prototyping and software development, PLCC for produc-  
n Surface mount package options  
— 32-pin TSOP  
— 32-pin PLCC  
Block Diagram  
DS012333-1  
AMG is a trademark of WSI, Incorporated.  
© 1997 Fairchild Semiconductor Corporation  
DS012333  
www.fairchildsemi.com  
1
PrintDate=1997/08/06 PrintTime=13:37:43 5610 ds012333 Rev. No. 3 cmserv Proof  
1

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