是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | SOIC | 包装说明: | VSSOP, TSSOP8,.12,20 |
针数: | 8 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.07 | 其他特性: | SPDT |
模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 2.3 mm |
湿度敏感等级: | 1 | 信道数量: | 2 |
功能数量: | 1 | 端子数量: | 8 |
标称断态隔离度: | 93 dB | 通态电阻匹配规范: | 3 Ω |
最大通态电阻 (Ron): | 34 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VSSOP | 封装等效代码: | TSSOP8,.12,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 2.5/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.9 mm |
最大信号电流: | 0.05 A | 子类别: | Multiplexer or Switches |
最大供电电流 (Isup): | 0.002 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2 V | 标称供电电压 (Vsup): | 4.5 V |
表面贴装: | YES | 最长断开时间: | 12 ns |
最长接通时间: | 12 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 2 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
NLAS1053US | ONSEMI |
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