是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | US-8 |
针数: | 8 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.33 |
Is Samacsys: | N | 模拟集成电路 - 其他类型: | SPST |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e0 |
长度: | 2.3 mm | 湿度敏感等级: | 1 |
正常位置: | NO | 信道数量: | 1 |
功能数量: | 2 | 端子数量: | 8 |
标称断态隔离度: | 73 dB | 通态电阻匹配规范: | 1.3 Ω |
最大通态电阻 (Ron): | 50 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 输出: | SEPARATE OUTPUT |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VSSOP |
封装等效代码: | TSSOP8,.12,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 240 |
电源: | 1.8/5 V | 认证状态: | Not Qualified |
座面最大高度: | 0.9 mm | 子类别: | Multiplexer or Switches |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.65 V |
标称供电电压 (Vsup): | 2.3 V | 表面贴装: | YES |
最长断开时间: | 10 ns | 最长接通时间: | 9 ns |
切换: | MAKE-BEFORE-BREAK | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 2 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
NLAS2066UST3G | ONSEMI |
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