是否无铅: | 含铅 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | 2.10 X 3 MM, US-8 |
针数: | 8 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 7.31 | 其他特性: | SPDT |
模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e0 | 长度: | 2.3 mm |
信道数量: | 2 | 功能数量: | 1 |
端子数量: | 8 | 标称断态隔离度: | 93 dB |
通态电阻匹配规范: | 3 Ω | 最大通态电阻 (Ron): | 34 Ω |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VSSOP |
封装等效代码: | TSSOP8,.12,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 240 |
电源: | 2.5/5 V | 认证状态: | Not Qualified |
座面最大高度: | 0.9 mm | 最大信号电流: | 0.05 A |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.002 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 4.5 V | 表面贴装: | YES |
最长断开时间: | 12 ns | 最长接通时间: | 12 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn80Pb20) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 2 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
NLAS1053USG | ONSEMI |
类似代替 |
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NLAS1053USG | ONSEMI |
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