0402/0603 Chip Inductors
NIS Seꢂies
FEATURES
• LASER CUT SPIRAL COIL OVER ALUMINA CORE
• SUPER MINIATURE EIA 0402 & 0603 SIZE IN RESIN ENCLOSED BODY
• HIGH Q AND SRF FOR HIGH FREQUENCY APPLICATIONS
• TIGHT TOLERANCES (D 0.3nHꢀ G 2ꢁ oꢂ r ꢃꢁꢄ
• BOTH FLOW AND REFLOW SOLDERING APPLICABLE
• EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
RoHS
Compliant
includes all homogeneous materials
SPECIFICATIONS
Inductance Range
Inductance Toleꢂance
Opeꢂating Tempeꢂatuꢂe Range
1.0 ~ 220nH
D ( 0.3nHꢄꢀ r ( ꢃꢁꢄ
-40°C ~ +8ꢃ°C
*See Paꢂt Numbeꢂ System foꢂ Details
Q-Factoꢂꢀ Self Resonant Fꢂequencyꢀ
DC Resistanceꢀ Rated DC Cuꢂꢂent
and INductance Toleꢂance
See Individual
Pꢂoduct Listings
ENVIRONMENTAL CHARACTERISTICS
Test
Specification
Test Method & Condition
Soldeꢂability
90ꢁ Min. Coveꢂage
Afteꢂ 3 Sec. Dip in +230°C Soldeꢂ Pot (Post Fluxꢄ
Afteꢂ ꢃ00 Hꢂs. at +60°C & 90-9ꢃꢁ RH (No Loadꢄ
Afteꢂ 10 Sec. at +260°C (ꢃ Min.ꢀ 120°C Pꢂe-Heatꢄ
Afteꢂ 2 Hꢂs peꢂ Axisꢀ 10~ꢃꢃHꢅꢀ 1.ꢃmm Amplitude
Afteꢂ 100 Cycles (-40°C ~ +8ꢃ°Cꢄ 30 Min. Each
Humidity Resistance
Soldeꢂing Effect
Low Fꢂequency Vibꢂation
Theꢂmal Shock
(1ꢄ No Evidence of Damage
(2ꢄ Inductance Shall Be Within
ꢃꢁ of Initial Value
(3ꢄ Q Factoꢂ Shall Be Within
20ꢁ of Initial Value
Low Tempeꢂatuꢂe Stoꢂage
Afteꢂ ꢃ00 Hꢂs. at -40°C
( 2ꢃꢁ foꢂ 0201 Siꢅeꢄ
High Tempeꢂatuꢂe Load Life (1ꢄ No Evidence of Damage
(2ꢄ Inductance Shall Be Within
Afteꢂ ꢃ00 Hꢂs. at +8ꢃ°C with Rated DC Cuꢂꢂent
10ꢁ of Initial Value
(3ꢄ Q Factoꢂ Shall Be Within
Afteꢂ ꢃ00 Hꢂs. at +60°C & 90-9ꢃꢁ RH with Rated
DC Cuꢂꢂent
Humidity Load Life
20ꢁ of Initial Value
PART NUMBER SYSTEM
PART AND LAND PATTERN DIMENSIONS (mm)
NIS04 r 22N TR F
Seꢂies
L
W
H
t
A
B
C
RoHS compliant
Packaging: TR = Tape & Reel
Inductance Code (N=decimal pointꢄ
(Ex. 2N2=2.2nHꢀ 33N=33nHꢄ
NIS04 1.0 0.0ꢃ 0.ꢃ 0.0ꢃ 0.ꢃ 0.0ꢃ 0.2 0.0ꢃ
NIS06 1.6 0.0ꢃ 0.8 0.1ꢃ 0.8 0.1ꢃ 0.3 0.2
0.ꢃ~0.6
0.8~1.0
1.ꢃ~1.7
2.0~2.6
0.ꢃ~0.6
0.7~0.9
Recommended land patteꢂns foꢂ flow and ꢂeflow soldeꢂing
Toleꢂance Code (D= 0.3nHꢀ G= 2ꢁꢀ r= ꢃꢁꢄ
Seꢂies (04=0402ꢀ 06=0603ꢄ
DIMENSION (mm)
Soldeꢂ Plated Teꢂminations
Land Patteꢂn
Resin Enclosuꢂe
NIS Chip
C
H
t
A
W
L
B
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
1