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NIS1161MTTAG PDF预览

NIS1161MTTAG

更新时间: 2023-06-19 14:31:47
品牌 Logo 应用领域
安森美 - ONSEMI 电池
页数 文件大小 规格书
7页 206K
描述
具有用于汽车高速数据线的电池短路阻断功能的低电容 ESD 保护

NIS1161MTTAG 数据手册

 浏览型号NIS1161MTTAG的Datasheet PDF文件第2页浏览型号NIS1161MTTAG的Datasheet PDF文件第3页浏览型号NIS1161MTTAG的Datasheet PDF文件第4页浏览型号NIS1161MTTAG的Datasheet PDF文件第5页浏览型号NIS1161MTTAG的Datasheet PDF文件第6页浏览型号NIS1161MTTAG的Datasheet PDF文件第7页 
NIV1161, NIS1161  
ESD Protection with  
Automotive Short-to-  
Battery Blocking  
Low Capacitance ESD Protection with  
short−to−battery blocking for Automotive  
High Speed Data Lines  
The NIS/NIV1161 is designed to protect high speed data lines from  
ESD as well as short to vehicle battery situations. The ultra−low  
capacitance and low ESD clamping voltage make this device an ideal  
solution for protecting voltage sensitive high speed data lines while  
www.onsemi.com  
MARKING  
DIAGRAM  
WDFN6  
CASE 511CB  
V6 M  
1
the low R  
FET limits distortion on the signal lines. The  
DS(on)  
V6 = Specific Device Code  
= Date Code  
flow−through style package allows for easy PCB layout and matched  
trace lengths necessary to maintain consistent impedance between  
high speed differential lines such as USB and LVDS protocols.  
M
Features  
PIN CONFIGURATION  
AND SCHEMATICS  
Low Capacitance (0.65 pF Typical, I/O to GND)  
Protection for the Following Standards:  
1
2
3
6
5
4
6
IEC 61000−4−2 (Level 4) & ISO 10605  
Integrated MOSFETs for Short−to−Battery Blocking  
NIV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
4
(Top View)  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Pin 2 − 5 V  
Compliant  
Typical Applications  
Automotive High Speed Signal Pairs  
USB 2.0/3.0  
Pin 1  
Pin 6  
D+  
D+ HOST  
Pin 3  
D− HOST  
Pin 4  
D−  
LVDS  
APIX 2/3  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Pin 5 − GND  
Pin 2 − 5 V  
Rating  
Symbol  
Value  
−55 to +150  
−55 to +150  
30  
Unit  
°C  
°C  
V
Operating Junction Temperature Range  
Storage Temperature Range  
Drain−to−Source Voltage  
T
J(max)  
TSTG  
V
DSS  
ORDERING INFORMATION  
Gate−to−Source Voltage  
V
GS  
10  
V
Device  
Package  
Shipping  
Lead Temperature Soldering  
T
260  
°C  
SLD  
NIV1161MTTAG  
WDFN−6  
(Pb−Free)  
3000 / Tape & Reel  
IEC 61000−4−2 Contact (ESD)  
IEC 61000−4−2 Air (ESD)  
ESD  
ESD  
8
15  
kV  
kV  
NIS1161MTTAG  
WDFN−6  
(Pb−Free)  
3000 / Tape & Reel  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
March, 2016 − Rev. 1  
NIV1161/D  

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