Datasheet > NFZ32SW901HN10L

NFZ32SW901HN10L

更新时间： 2024-02-20 14:13:22

品牌	Logo	应用领域
村田 - MURATA		/
页数	文件大小	规格书
7页	196K
描述
Data Line Filter,

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技术参数
数据手册

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NFZ32SW901HN10L 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	Reach Compliance Code：	compliant
Factory Lead Time：	8 weeks	风险等级：	2.15
Base Number Matches：	1

NFZ32SW901HN10L 数据手册

Reference Only

SpecNo.JENF243J-0005A-01

P5/7

11. Notice

This product is designed for solder mounting. (Reflow soldering only)

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing (Reflow Soldering)

Recommended land pattern for reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Land

3.8

Chip Coil

Chip Noise Filter

Solder Resist

2.0

(in mm)

1.3

11.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 100μm to 150μm

Solder

Other flux (except above) Please contact us for details, then use.

11.3 soldering conditions (Reflow)

 Pre-heating should be in such a way that the temperature difference between solder and product surface

is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the

temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the

deterioration of product quality.

Temp.

(℃)

260℃

230℃

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max

90s±30s

Time(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s

245±3°C

Limit Profile

Pre-heating

Heating

above 230°C、60s max.

260°C,10s

Peak temperature

Cycle of reflow

2 times

MURATA MFG.CO., LTD

1 2 3 456 7

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