Reference Only
8.Environmental Performance (It shall be soldered on the substrate.)
SpecNo.JENF243J-0005A-01
P3/7
No.
Item
Specification
Appearance: No damage
Impedance Change: within ± 30%
DC Resistance Change:within ± 10% Then measured after exposure in the room
condition for 24±2 hours.
Test Method
Temperature: 85±2°C
Time: 1000± 048 hours
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Temperature: -40±2°C
Time: 1000± 048 hours
Then measured after exposure in the room
condition for 24±2 hours.
Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000± 048 hours
Then measured after exposure in the room
condition for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step: Ordinary temp. / 10 to 15 minutes
3 step: +85±2°C / 30±3 min.
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
+0.1
Lead-in/out wire
※
1.5
-0
(
)
0.2
The packing directions of the chip coil
※
in taping are unified with the in/out
positions of the lead wire.
Dimension of the Cavity is measured
at the bottom side.
4.0±0.1
2.0±0.05
4.0±0.1
1.7±0.2
(in mm)
2.9±0.2
Direction of feed
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
5N min.
MURATA MFG.CO., LTD