是否无铅: | 含铅 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | SOP-24 |
针数: | 24 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.82 |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | R-PDSO-G24 |
JESD-609代码: | e0 | 长度: | 15.245 mm |
功能数量: | 1 | 端子数量: | 24 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP24,.4 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 240 |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 2.65 mm | 子类别: | Other Analog ICs |
最大供电电流 (Isup): | 24 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | BIPOLAR |
温度等级: | AUTOMOTIVE | 端子面层: | Tin/Lead (Sn80Pb20) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 7.5 mm | Base Number Matches: | 1 |
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