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NCP6335AFCCT1G

更新时间： 2024-11-27 01:16:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
35页 1382K
描述
Configurable 4.0 A Step Down Converter - Transient Load Helper

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中文翻译

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NCP6335AFCCT1G 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：VFBGA,Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.69可调阈值：YES
模拟集成电路 - 其他类型：POWER SUPPLY SUPPORT CIRCUITJESD-30 代码：R-PBGA-B20
长度：2.02 mm信道数量：1
功能数量：1端子数量：20
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：VFBGA
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED座面最大高度：0.6 mm
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：2.3 V
标称供电电压 (Vsup)：3.6 V表面贴装：YES
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.4 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：1.62 mm
Base Number Matches：1

NCP6335AFCCT1G 数据手册

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NCP6335xFCCT1G  
Configurable 4.0 A Step  
Down Converter - Transient  
Load Helper  
The NCP6335 is a synchronous buck converter optimized to supply  
the different sub systems of portable applications powered by one cell  
Li−Ion or three cell Alkaline/NiCd/NiMH batteries. The device is able  
to deliver up to 4.0 A, with programmable output voltage from 0.6 V  
to 1.4 V. It can share the same output rail with another DC−to−DC  
converter and works as a transient load helper. Operation at a 3 MHz  
switching frequency allows the use of small components.  
Synchronous rectification and automatic PWM/PFM transitions  
improve overall solution efficiency. The NCP6335 is in a space  
saving, low profile 2.0 x 1.6 mm CSP−20 package.  
www.onsemi.com  
WLCSP20  
CASE 568AG  
MARKING DIAGRAM  
6335x  
AWLYWW  
G
Feature  
• Input Voltage Range from 2.3 V to 5.5 V: Battery and 5 V Rail  
Powered Applications  
• Programmable Output Voltage: 0.6 V to 1.4 V in 6.25 mV Steps  
x
= D1: Prototype  
= F: 3.5 A, 1.025 − 1.150 V  
= B: 3.0 A, 1.225 V  
= A: 1.0 A, 1.225 V  
= D: 2.5 A, 1.1 V  
= L: 3.5A, 0.9 V  
= Assembly Location  
• Modular Output Stage Drive Strength for Increased Efficiency  
Depending on the Output Current  
• 3 MHz Switching Frequency with on Chip Oscillator  
• Uses 470 nH Inductor and 2 x 22 mF Capacitors for Optimized  
Footprint and Solution Thickness  
A
WL = Wafer Lot  
= Year  
WW = Work Week  
• PFM/PWM Operation for Optimum Increased Efficiency  
Y
• Low 35 mA Quiescent Current  
G
= Pb−Free Package  
2
• I C Control Interface with Interrupt and Dynamic Voltage Scaling  
Pb−Free indicator, G or microdot (G),  
Support  
may or may not be present  
• Enable Pins, Power Good/Fail Signaling  
• Thermal protections and Temperature Management  
• Transient Load Helper: Share the Same Rail with Another DCDC  
• Small 2.0 x 1.6 mm / 0.4 mm pitch CSP Package  
• These are Pb−Free Devices  
PINOUT DIAGRAM  
1
2
3
4
A
VSEL  
EN  
SCL  
FB  
Typical Applications  
• Smartphones  
• Webtablets  
PGND  
INTB*  
PGND  
PG*  
B
SDA  
PGND  
AVIN  
PVIN  
AGND  
PGND  
C
D
E
PGND  
PGND  
AVIN  
PVIN  
D1  
D2  
E1  
E2  
Core  
Supply Input  
AGND  
B4  
4.7 uF  
DCDC  
4.0 A  
Thermal  
Protection  
SW  
SW  
SW  
PVIN  
PVIN  
470 nH  
D3  
D4  
E3  
E4  
SW  
Enable Control EN  
A2  
A1  
Modular  
Driver  
Operating  
Input  
2x 22 uF  
VSEL  
C1  
C2  
C3  
C4  
PGND  
SW  
Output  
Monitoring  
B3  
B2  
B1  
A3  
Power Fail  
Interrupt  
(Top View)  
*Optional  
FB  
A4  
DCDC  
3 MHz  
Controller  
Processor  
Core  
SDA  
SCL  
Processor I@C  
I@C  
Sense  
Control Interface  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 34 of  
this data sheet.  
Figure 1. Typical Application Circuit  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
June, 2015 − Rev. 2  
NCP6335DFCC/D  
1234567...35

中文翻译

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