是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | BGA | 包装说明: | 1.70 X 1.70 MM, LEAD FREE, FLIP-CHIP, CSP-8 |
针数: | 8 | Reach Compliance Code: | unknown |
风险等级: | 5.69 | Is Samacsys: | N |
其他特性: | CAN BE CONFIGURED IN CURRENT MODE | 模拟集成电路 - 其他类型: | SWITCHING REGULATOR |
控制模式: | VOLTAGE-MODE | 控制技术: | PULSE WIDTH MODULATION |
最大输入电压: | 5.5 V | 最小输入电压: | 2.7 V |
标称输入电压: | 3.6 V | JESD-30 代码: | S-PBGA-B8 |
JESD-609代码: | e3 | 长度: | 1.7 mm |
湿度敏感等级: | NOT SPECIFIED | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 最大输出电流: | 0.56 A |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | COMMERCIAL |
座面最大高度: | 0.66 mm | 表面贴装: | YES |
切换器配置: | BOOST | 最大切换频率: | 1200 kHz |
温度等级: | INDUSTRIAL | 端子面层: | MATTE TIN |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 1.7 mm | Base Number Matches: | 1 |
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