是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | TSOP | 包装说明: | TSOP, TSOP5/6,.11,37 |
针数: | 5 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 1 week | 风险等级: | 0.89 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDSO-G5 | JESD-609代码: | e3 |
长度: | 3 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 5 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP | 封装等效代码: | TSOP5/6,.11,37 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 0.8/10 V |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.0013 mA |
最大供电电压 (Vsup): | 10 V | 最小供电电压 (Vsup): | 0.8 V |
标称供电电压 (Vsup): | 1.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子面层: | Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.95 mm | 端子位置: | DUAL |
阈值电压标称: | +2.4V | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
NCP303LSN30T1G | ONSEMI |
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