是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | HALOGEN FREE AND LEAD FREE, WCSP-9 | 针数: | 9 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 1 week |
风险等级: | 5.77 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 412361 |
Samacsys Pin Count: | 9 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | BGA | Samacsys Footprint Name: | 9-pin FLIP-CHIP CSP |
Samacsys Released Date: | 2017-11-04 11:44:58 | Is Samacsys: | N |
标称带宽: | 20 kHz | 商用集成电路类型: | AUDIO AMPLIFIER |
JESD-30 代码: | S-PBGA-B9 | JESD-609代码: | e1 |
长度: | 1.45 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 9 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 标称输出功率: | 2.4 W |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA9,3X3,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 电源: | 3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.66 mm |
子类别: | Audio/Video Amplifiers | 最大压摆率: | 4 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
宽度: | 1.45 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TS4972EIJT | STMICROELECTRONICS |
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