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NB3L202K_18 PDF预览

NB3L202K_18

更新时间: 2024-10-03 01:07:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
14页 143K
描述
Differential 1:2 HCSL Fanout Buffer

NB3L202K_18 数据手册

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NB3L202K  
2.5 V, 3.3 V Differential 1:2  
HCSL Fanout Buffer  
Description  
The NB3L202K is a differential 1:2 Clock fanout buffer with  
High−speed Current Steering Logic (HCSL) outputs. Inputs can  
directly accept differential LVPECL, LVDS, and HCSL signals.  
Single−ended LVPECL, HCSL, LVCMOS, or LVTTL levels are  
accepted with a proper external Vth reference supply per Figures 4  
and 6. The input signal will be translated to HCSL and provides two  
identical copies operating up to 350 MHz.  
The NB3L202K is optimized for ultra−low phase noise, propagation  
delay variation and low output–to–output skew, and is DB200H  
compliant. As such, system designers can take advantage of the  
NB3L202K’s performance to distribute low skew clocks across the  
backplane or the motherboard making it ideal for Clock and Data  
distribution applications such as PCI Express, FBDIMM, Networking,  
Mobile Computing, Gigabit Ethernet, etc.  
www.onsemi.com  
MARKING  
DIAGRAM  
1
QFN16  
NB3L  
202K  
ALYWG  
G
3x3  
CASE 485FM  
1
NB3L202K = Specific Device Code  
A
L
= Assembly Location  
= Wafer Lot  
Output drive current is set by connecting a 475 W resistor from  
IREF (Pin 10) to GND per Figure 11. Outputs can also interface to  
LVDS receivers when terminated per Figure 12.  
Y
W
G
= Year  
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
Features  
Maximum Input Clock Frequency > 350 MHz  
2.5 V 5% / 3.3 V 10% Supply Voltage Operation  
2 HCSL Outputs  
ORDERING INFORMATION  
See detailed ordering and shipping information page 13 of this  
data sheet.  
DB200H Compliant  
PCIe Gen 3, Gen 4 Compliant  
Individual OE Control Pin for Each Output  
100 ps Max Output−to−Output Skew Performance  
1 ns Typical Propagation Delay  
500 ps Typical Rise and Fall Times  
80 fs Maximum Additive RMS Phase Jitter  
−40°C to +85°C Ambient Operating Temperature  
QFN 16−pin Package, 3 mm x 3 mm  
These Devices are Pb−Free and are RoHS Compliant  
Typical Applications  
PCI Express  
FBDIMM  
Mobile Computing  
Networking  
Gigabit Ethernet  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
January, 2018 − Rev. 4  
NB3L202K/D  

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