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MXSMCG11CE3 PDF预览

MXSMCG11CE3

更新时间： 2024-11-24 04:45:47
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管
页数 文件大小 规格书
4页 483K
描述
Trans Voltage Suppressor Diode, 1500W, 11V V(RWM), Bidirectional, 1 Element, Silicon, DO-215AB, ROHS COMPLIANT, PLASTIC PACKAGE-2

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MXSMCG11CE3 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：DO-215AB包装说明：ROHS COMPLIANT, PLASTIC PACKAGE-2
针数：2Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.75最大击穿电压：14.9 V
最小击穿电压：12.2 V配置：SINGLE
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码：DO-215ABJESD-30 代码：R-PDSO-G2
JESD-609代码：e3湿度敏感等级：1
最大非重复峰值反向功率耗散：1500 W元件数量：1
端子数量：2封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED极性：BIDIRECTIONAL
最大功率耗散：1.56 W认证状态：Not Qualified
最大重复峰值反向电压：11 V表面贴装：YES
技术：AVALANCHE端子面层：MATTE TIN
端子形式：GULL WING端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED

MXSMCG11CE3 数据手册

 浏览型号MXSMCG11CE3的Datasheet PDF文件第2页浏览型号MXSMCG11CE3的Datasheet PDF文件第3页浏览型号MXSMCG11CE3的Datasheet PDF文件第4页 
MSMCJ5.0A thru MSMCJ170CA, e3  
and MSMCG5.0A thru MSMCG170CA, e3  
SURFACE MOUNT 1500 Watt  
Transient Voltage Suppressor  
I R E L A N D D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The MSMCJ5.0A-170A or MSMCG5.0CA-170CA series of 1500 W Transient  
Voltage Suppressors (TVSs) protects variety of voltage-sensitive  
a
components. It is available in J-bend design (SMCJ) with the DO-214AB  
package for greater PC board mounting density or in a Gull-wing design  
(SMCG) in the DO-215AB for visible solder connections. Selections include  
unidirectional and bidirectional as well as RoHS Compliant with an e3 suffix.  
They can protect from secondary lightning effects per IEC61000-4-5 and class  
levels defined herein, or for inductive switching environments and induced RF  
protection. Since their response time is virtually instantaneous, they can also  
be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
NOTE: All SMC series are  
equivalent to prior SMM package  
identifications.  
FEATURES  
APPLICATIONS / BENEFITS  
High-reliability controlled devices  
100% surge tested  
Protection from ESD, and EFT per IEC 61000-4-2 and  
IEC 61000-4-4  
Secondary lightning protection per IEC61000-4-5 with  
42 Ohms source impedance:  
Economical surface mount design in both J-bend or  
Gull-wing terminations  
Class 1: SMC 5.0 to SMC 170A or CA  
Class 2: SMC 5.0 to SMC 150A or CA  
Class 3: SMC 5.0 to SMC 75A or CA  
Class 4: SMC 5.0 to SMC 36A or CA  
Available in both Unidirectional and Bidirectional  
construction with a CA suffix  
Optional upscreening available by replacing M prefix  
with MA, MX or MXL prefixes. These prefixes specify  
various screening and conformance inspection options  
based on MIL-PRF-19500. Refer to Micronote 129 for  
more details on the screening options.  
Secondary lightning protection per IEC61000-4-5 with  
12 Ohms source impedance:  
Class 1 : SMC 5.0 to SMC 90A or CA  
Class 2: SMC 5.0 to SMC 45A or CA  
Class 3: SMC 5.0 to SMC 24A or CA  
Class 4: SMC 5.0 to SMC 11A or CA  
Axial-lead equivalent packages for thru-hole mounting  
available as 1.5KE6.8A to 1.5KE200CA or 1N6267 thru  
1N6303A and 1N5908 (consult factory for other  
surface mount options)  
Secondary lightning protection per IEC61000-4-5 with  
2 Ohms source impedance:  
Moisture classification is Level 1 with no dry pack  
required per IPC/JEDEC J-STD-020B  
Class 2: SMC 5.0 to SMC 22A or CA  
Class 3: SMC 5.0 to SMC 10A or CA  
RoHS compliant devices available by adding “e3” suffix  
Selections for 5.0 to 170 volts standoff voltages (VWM  
)
Protection from switching transients and induced RF  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Peak Pulse Power dissipation at 25ºC: 1500 watts at  
CASE: Void-free transfer molded thermosetting  
epoxy body meeting UL94V-0  
10/1000 μs (also see Fig 1,2, and 3)  
Impulse repetition rate (duty factor): 0.01%  
TERMINALS: Gull-wing or C-bend (modified J-bend)  
leads, tin-lead or RoHS compliant annealed matte-tin  
plating solderable to MIL-STD-750, method 2026  
tclamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
Operating and Storage temperature: -65ºC to +150ºC  
Thermal resistance: 20ºC/W junction to lead, or 80ºC/W  
junction to ambient when mounted on FR4 PC board  
(1oz Cu) with recommended footprint (see last page)  
Steady-State Power dissipation: 6 watts at TL = 30oC,  
or 1.56 watts at TA = 25ºC when mounted on FR4 PC  
board with recommended footprint  
POLARITY: Cathode indicated by band. No marking  
on bi-directional devices  
MARKING: Part number without “SM” prefix (e.g.  
MC5.0A, MC5.0CA, MXC5.0A, MC5.0CAe3, MC36A,  
MAC36CA etc.)  
TAPE & REEL option: Standard per EIA-481-2 with  
16 mm tape, 750 per 7 inch reel or 2500 per 13 inch  
reel (add “TR” suffix to part number)  
Forward Surge: 200 Amps peak impulse of 8.3 ms  
half-sine wave at 25ºC (unidirectional only)  
Solder temperatures: 260 ºC for 10 s (maximum)  
WEIGHT: 0.25 grams  
Copyright 2010  
Preliminary, 2-10-10  
Microsemi  
Page 1  
Ireland Division  
Gort Road Business Park, Ennis, Co. Clare, Ireland. Tel. +353 (0) 65 6840044  
1234

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