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MXLSMCJ5.0CAE3TR PDF预览

MXLSMCJ5.0CAE3TR

更新时间: 2024-11-15 18:22:47
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管电视
页数 文件大小 规格书
4页 186K
描述
1500W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC PACKAGE-2

MXLSMCJ5.0CAE3TR 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:DO-214AB
包装说明:R-PDSO-J2针数:2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.27
Is Samacsys:N其他特性:HIGH RELIABILITY
最大击穿电压:7 V最小击穿电压:6.4 V
击穿电压标称值:6.7 V最大钳位电压:9.2 V
配置:SINGLE二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJEDEC-95代码:DO-214AB
JESD-30 代码:R-PDSO-J2JESD-609代码:e3
湿度敏感等级:1最大非重复峰值反向功率耗散:1500 W
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-65 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性:BIDIRECTIONAL最大功率耗散:1.56 W
认证状态:Not Qualified参考标准:MIL-19500
最大重复峰值反向电压:5 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:Matte Tin (Sn) - annealed端子形式:J BEND
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

MXLSMCJ5.0CAE3TR 数据手册

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TECHNICAL DATA SHEET  
Gort Road Business Park, Ennis, Co. Clare, Ireland.  
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298  
6 Lake Street, Lawrence, MA 01841  
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803  
Website: http://www.microsemi.com  
- High Reliability controlled devices  
SURFACE MOUNT 1500 Watt  
Transient Voltage Suppressor  
- Unidirectional (A) and Bidirectional (CA) construction  
- Available in both J-bend and Gull-wing terminations  
- Selections for 5.0 to 170 V standoff voltages (VWM  
)
LEVELS  
M, MA, MX, MXL  
DEVICES  
MSMCJ5.0A thru MSMCJ170CA, e3  
and MSMCG5.0A thru MSMCG170CA, e3  
FEATURES  
ƒ
ƒ
ƒ
High reliability controlled devices with fabrication and assembly lot traceability  
100 % surge tested devices  
Optional upscreening available by replacing the M prefix with MA, MX or MXL prefixes.  
These prefixes specify various screening and conformance inspection options based on  
MIL-PRF-19500. Refer to MicroNote 129 for more details on the screening options.  
ƒ
Axial-lead equivalent packages for thru-hole mounting available as 1.5KE6.8A to  
1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (consult factory for other surface mount  
options).  
Refer to table below  
for dimensions  
ƒ
ƒ
ƒ
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B  
RoHS compliant devices available by adding an “e3” suffix  
3σ lot norm screening performed on Standby Current ID  
APPLICATIONS / BENEFITS  
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ƒ
ƒ
Protection from switching transients and induced RF  
Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4  
Secondary lightening protection per IEC 61000-4-5 with 42 Ohms source impedance:  
o
o
o
o
Class 1: MSMC5.0A to MSMC170CA  
Class 2: MSMC5.0A to MSMC150CA  
Class 3: MSMC5.0A to MSMC75CA  
Class 4: MSMC5.0A to MSMC36CA  
ƒ
ƒ
Secondary lightening protection per IEC 61000-4-5 with 12 Ohms source impedance:  
o
o
o
o
Class 1: MSMC5.0A to MSMC90CA  
Class 2: MSMC5.0A to MSMC45CA  
Class 3: MSMC5.0A to MSMC24CA  
Class 4: MSMC5.0A to MSMC11CA  
Secondary lightening protection per IEC 61000-4-5 with 2 Ohms source impedance:  
o
o
Class 2: MSMC5.0A to MSMC22CA  
Class 3: MSMC5.0A to MSMC10CA  
MAXIMUM RATINGS  
Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000 μs (also see Figures 1,2, and  
ƒ
3) with impulse repetition rate (duty factor) of 0.01 % or less  
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ƒ
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tclamping (0 volts to VBR min.): < 100 ps theoretical for unidirectional and <5 ns for bidirectional  
Operating and Storage temperature: -65 ºC to +150 ºC  
Thermal resistance: 20 ºC/W junction to lead, or 80 ºC/W junction to ambient when mounted  
on FR4 PC board (1oz Cu) with recommended footprint (see page 2)  
Steady-State Power dissipation: 6 watts at TL = 30 ºC, or 1.56 watts at TA = 25 ºC when  
mounted on FR4 PC board with recommended footprint (see page 2)  
Forward Surge: 200 Amps peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional  
only)  
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ƒ
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Solder temperatures: 260 ºC for 10 s (maximum)  
RF01001 Rev B, Sept 2011  
High Reliability Product Group  
Page 1 of 4  

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