生命周期: | Active | 零件包装代码: | DIP |
包装说明: | CERAMIC, DIP-24 | 针数: | 24 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.39.00.01 | 风险等级: | 5 |
最大模拟输入电压: | 5 V | 最小模拟输入电压: | -5 V |
最长转换时间: | 5.2 µs | 转换器类型: | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码: | R-GDIP-T24 | 最大线性误差 (EL): | 0.0244% |
标称负供电电压: | -15 V | 模拟输入通道数量: | 1 |
位数: | 12 | 功能数量: | 1 |
端子数量: | 24 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 输出位码: | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY |
输出格式: | PARALLEL, WORD | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 认证状态: | Not Qualified |
采样并保持/跟踪并保持: | SAMPLE | 筛选级别: | MIL-STD-883 Class B |
座面最大高度: | 5.08 mm | 标称供电电压: | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 7.62 mm | Base Number Matches: | 1 |
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