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MX1N5936UR-1TR PDF预览

MX1N5936UR-1TR

更新时间: 2024-11-24 04:28:07
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
3页 377K
描述
Zener Diode, 30V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2

MX1N5936UR-1TR 数据手册

 浏览型号MX1N5936UR-1TR的Datasheet PDF文件第2页浏览型号MX1N5936UR-1TR的Datasheet PDF文件第3页 
1N5913BUR-1 thru 1N5956BUR-1  
(or MLL5913B thru MLL5956B)  
METALLURGICALLY BONDED GLASS  
SURFACE MOUNT 1.5 WATT ZENERS  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB  
package is similar in electrical features to the JEDEC registered 1N5913B  
thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection  
for applications of high density and low parasitic requirements. Due to its  
glass hermetic qualities and metallurgically enhanced internal contacts, it  
may also be used for high reliability applications when required by a source  
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as  
described in Features below. Zener voltage tolerance options are identified  
by part number suffix including tight-tolerance. A variety of other Zener  
product offerings and packages are available by Microsemi to meet higher  
DO-213AB  
or lower power and test current applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Electrically similar to the JEDEC registered 1N5913B  
Regulates voltage over a broad operating current  
thru 1N5956B zener series  
and temperature range  
Zener voltages available 3.3V to 200V  
Wide selection from 3.3 to 200 V  
Leadless package for surface mounting  
Ideal for high density mounting  
Options for screening in accordance with MIL-PRF-  
19500 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or MSP prefixes  
respectively to part numbers, e.g. MX1N5913BUR-1,  
MV1N5923CUR-1, MSP1N5952DUR-1, etc.  
Surface mount equivalents also available as  
SMBJ5913B to SMBJ5956B, SMBG5913B to  
SMBG5956B, or SMAJ5913B to SMAJ5956B (see  
separate data sheets)  
Metallurgically enhanced internal contact design for  
greater reliability and lower thermal resistance  
Standard voltage tolerances are +/- 5% with B suffix  
and 10 % with A suffix identification  
Tight tolerances available in plus or minus 2% or  
1% with C or D suffix respectively  
Nonsensitive to ESD  
Hermetically sealed glass package  
Specified capacitance (see Figure 2)  
Plastic body axial-leaded Zener equivalents are also  
available as 1N5913BP to 1N5956BP (see separate  
data sheet)  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Power dissipation at 25ºC: 1.5 watts (also see  
derating in Figure 1).  
CASE: Hermetically sealed DO-213AB glass MELF  
package  
Operating and Storage temperature: -65ºC to +175ºC  
TERMINALS: End caps, tin-lead plated solderable  
Thermal Resistance: 40 ºC/W junction to end cap, or  
120ºC/W junction to ambient when mounted on FR4  
PC board (1 oz Cu) with recommended footprint (see  
last page)  
per MIL-STD-750, method 2026  
POLARITY: Cathode indicated by band. Diode to  
be operated with the banded end positive with  
respect to the opposite end for Zener regulation  
Steady-State Power: 1.50 watts at TEC < 115oC, or  
1.25 watts at TA = 25ºC when mounted on FR4 PC  
board and recommended footprint as described for  
thermal resistance (also see Figure 1)  
MARKING: Cathode band only  
TAPE & REEL optional: Standard per EIA-481-B  
with 12 mm tape, 1500 per 7 inch reel or 5000 per  
13 inch reel (add “TR” suffix to part number)  
WEIGHT: 0.05 grams  
See package dimensions on last page  
Forward voltage @200 mA: 1.2 volts (maximum)  
Solder Temperatures: 260 ºC for 10 s (max)  
Copyright 2002  
Microsemi  
Page 1  
11-05-2003 REV C  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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