Datasheet > MVAS-114-ZSST-13-L

MVAS-114-ZSST-13-L

更新时间： 2024-12-01 19:32:15

品牌	Logo	应用领域
申泰 - SAMTEC		/
页数	文件大小	规格书
2页	490K
描述
IC Socket, PGA114, 114 Contact(s), ROHS COMPLIANT

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

MVAS-114-ZSST-13-L 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	ROHS COMPLIANT
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8536.69.40.40	风险等级：	5.15
联系完成配合：	GOLD (10) OVER NICKEL	联系完成终止：	Gold (Au) - with Nickel (Ni) barrier
触点材料：	BERYLLIUM COPPER ALLOY	设备插槽类型：	IC SOCKET
使用的设备类型：	PGA114	外壳材料：	POLYESTER
JESD-609代码：	e4	触点数：	114
Base Number Matches：	1

MVAS-114-ZSST-13-L 数据手册

浏览型号MVAS-114-ZSST-13-L的Datasheet PDF文件第2页

F-208 SUPPLEMENT

MPAS–144–ZSGT–13

MPAS–068–ZSGT–11

MPAS, MVAS,

PIN GRID ARRAY SOCKETS^{MSAS SERIES}

Mates with:

BODY

STYLE

COUNT

LEAD PLATING

STYLE OPTION

PIN OUT

CODE

MPAT, MVAT, MHAT, MSAT

OPTION

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MPAS

or www.samtec.com?MVAS

Standard

Polyester

–2

MPAS

MVAS

MSAS

= (9,14).360

Wire-Wrap

(–ZW Only)

= 30µ" (0,76µm)

Gold Contact,

10µ" (0,25µm)

Gold Shell

MPAS, MVAS

Insulator Material:

Black G.F. Polyester

Contact:

BeCu

Shell:

Brass except Style K

Phospher Bronze

–“XXX”

= Total Number

of Filled

Open

Body Polyester

Hi-Temp LCP

Open Body

Positions

–3

= (6,60).260

Wire-Wrap

(–ZW Only)

No. of Positions X .100 (2,54) SQ

= 30µ" (0,76µm)

Gold Contact,

Operating Temp Range:

-55°C to +105°C with Tin

-55°C to +125°C with Gold

Plating:

ALSO AVAILABLE

Tin Shell

(2,54)

.100

–L

Au over 50µ"(1,27µm) Ni or

Sn over 100µ" (2,58µm) Cu or

50µ" (1,27µm) Ni

RoHS compliant

options.

Call Samtec.

= Locking

Socket

Current Rating:

= Tin Contact

and Shell

(–ZS Only)

Contact Resistance:

10mΩ max

(Styles –ZS &

ZW Only)

Lead Size Range:

.015" (0,38mm) to

.022" (0,56mm) DIA except

Style ZL = .015" (0,38mm) to

.020" (0,51mm) DIA

Insertion Force:

(Single contact only) Style ZU

= 1.5oz (0,42N) max, all others

= 2.5 oz (0,69N) avg, 5.5 oz

(1,53N) max, except Styles J

& K = 9 oz (2,50N) avg, 16 oz

(4,45N) max

(7,62)

.300

(3,43)

.135

= 10µ" (5,08µm)

Gold Contact,

Tin Shell

Requires GT

Plating Option

(Style –ZS only)

Withdrawal Force:

(Single contact only) Style ZU

= 1.5oz (0,42N) max, all others

= 2.0 oz (0,56N) avg, 0.35 oz

(0,97N) min, except Styles J &

K = 2.5 oz (0,69N) avg, 1.5 oz

(0,42N) min

= Elevated

= Wire-Wrap

–ZW

–ZE or –ZH

(0,76)

.030

Lead-Free Solderable:

Wave, only

(1,32)

.052

DIA

(4,90)

.193

(0,76)

.030

LEAD

STYLE

OAL

RoHS Compliant:

DIA

TAIL

Shorter w/w

tail lengths

available.

(0,51) (4,32) (8,86) (13,77)

–ZE

–ZH

(1,32)

.052

DIA

.020 .170 .349 .542

(0,46) (3,81) (12,95) (17,86)

.018 .150 .510 .703

Note: Some sizes, styles and

options are non-standard,

non-returnable.

See OPTION.

(12,95)

.510

(0,89)

.035

DIA

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MSAS

Insertion Depth = .125" to .157"

Insertion Depth = .125" to .170"

Style ZE Component Part No. = EZ-2P3

Insertion Depth = .125" to .145"

Style ZW Component Part No. = EZ-1W1(1)

Style ZW-2 Component Part No. = EZ-1W1(2)

Style ZW-3 Component Part No. = EZ-1W1(3)

(0,64)

.025

Style ZH Component Part No. = EZ-2P2

MSAS

Same as

= Low Proﬁle

= Printed Circuit

MPAS except:

–ZL

–ZS, –ZU, –ZA, –J, –K

Insulator Material:

Black Liquid Crystal Polymer

Max Processing Temp:

230°C for 30 to 60 seconds

Locking lead (–L) available.

See OPTION.

(0,76)

LEAD

OAL

.030

STYLE

–ZS, –ZU

–ZA

(0,76)

TAIL

DIA

.030

(3,10)

.122

(3,18) (7,62)

.125

.300

(0,51)

.020

(5,33)

.230

(1,32)

.052

DIA

Insertion Depth = .095" to .145",

Style ZS Component Part No. = EZ-1P1

Style ZA Component Part No. = EZ-6P1

Option L Component Part No.

.010

(4,57) (8,89)

.180

.350

(0,51)

.020

(1,32)

.052

DIA

(0,25)

(10,41) (15,24)

.410

.600

(0,64)

.025

–J

(0,76)

.030

DIA

= SC-1L1 or EZ-1L1

Insertion Depth = .095" to .138",

Style J Component Part No. = SC-1P3

Insertion Depth = .095" to .157",

Style K Component Part No. = SC-2P1

(12,95) (17,86)

.510

.703

(0,89)

.035

–K

Note: Some sizes, styles and

options are non-standard,

non-returnable.

Insertion Depth = .105" to .170"

Component No. = EZ-3P1

Styles J & K =16 oz/pin insertion force

WWW.SAMTEC.COM

中文翻译

下载PDF

与MVAS-114-ZSST-13-L相关器件

型号	品牌	获取价格	描述	数据表
MVAS-114-ZSTE-13	SAMTEC	获取价格	IC Socket, PGA114, 114 Contact(s),
MVAS-114-ZSTT-13	SAMTEC	获取价格	IC Socket, PGA114, 114 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder, ROHS CO
MVAS-114-ZSTT-13-L	SAMTEC	获取价格	IC Socket, PGA114, 114 Contact(s), ROHS COMPLIANT
MVAS-114-ZTGG-13	SAMTEC	获取价格	IC Socket, PGA114, 114 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder, ROHS CO
MVAS-114-ZTTT-13	SAMTEC	获取价格	IC Socket, PGA114, 114 Contact(s),
MVAS-114-ZU-GG-13	SAMTEC	获取价格	PGA114, IC SOCKET, ROHS COMPLIANT
MVAS-114-ZU-GT-13	SAMTEC	获取价格	PGA114, IC SOCKET, ROHS COMPLIANT
MVAS-114-ZUTT-13	SAMTEC	获取价格	IC Socket, PGA114, 114 Contact(s),
MVAS-114-ZWGG-13	SAMTEC	获取价格	IC Socket, PGA114, 114 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Wire Wrap,
MVAS-114-ZWGG-13-2	SAMTEC	获取价格	IC Socket, PGA114, 114 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Wire Wrap, ROHS

与MVAS-114-ZSST-13-L相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

53
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

42
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

70
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

66

产品中心

服务支持

精选活动

关于我们

帮助中心

MVAS-114-ZSST-13-L

MVAS-114-ZSST-13-L 技术参数

MVAS-114-ZSST-13-L 数据手册

与MVAS-114-ZSST-13-L相关器件

与MVAS-114-ZSST-13-L相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MVAS-114-ZSST-13-L

MVAS-114-ZSST-13-L 技术参数

MVAS-114-ZSST-13-L 数据手册

与MVAS-114-ZSST-13-L相关器件

与MVAS-114-ZSST-13-L相关文章

您还可以找

您在本页遇到什么问题？