MURA260T3
Preferred Device
Surface Mount
Ultrafast Power Rectifier
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
http://onsemi.com
Features
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
ULTRAFAST RECTIFIER
2 AMPERES, 600 VOLTS
• High Temperature Glass Passivated Junction
• Low Forward Voltage Drop (1.2 V Max @ 2.0 A, T = 150°C)
J
• Pb−Free Package is Available
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 70 mg (Approximately)
SMA
CASE 403D
PLASTIC
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MARKING DIAGRAM
• Polarity: Polarity Band Indicates Cathode Lead
• ESD Protection: Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
U5J
AYWW G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
600
V
RRM
V
RWM
V
U5J = Device Code
R
A
Y
= Assembly Location
= Year
Average Rectified Forward Current
I
A
A
F(AV)
@ T = 145°C
1.0
2.0
L
WW = Work Week
@ T = 110°C
L
G
= Pb−Free Package
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
30
FSM
ORDERING INFORMATION
Operating Junction Temperature Range
T
−65 to +175
°C
J
†
Device
Package
Shipping
THERMAL CHARACTERISTICS
MURA260T3
SMA
5000/Tape & Reel
5000/Tape & Reel
Characteristic
Symbol
Value
Unit
MURA260T3G
SMA
(Pb−Free)
Thermal Resistance, Junction−to−Lead
Psi
24
°C/W
JL
(T = 25°C) (Note 1)
Thermal Resistance, Junction−to−Ambient
(Note 1)
(Note 2)
R
L
216
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
Preferred devices are recommended choices for future use
1. Rating applies when surface mounted on the minimum pad size recommended,
PC Board FR−4.
and best overall value.
2. In compliance with JEDEC 51, these values (historically represented by R
)
q
JL
are now referenced as Psi
.
JL
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 3
MURA260T3/D