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MUN5213 PDF预览

MUN5213

更新时间: 2024-11-14 22:45:47
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管开关光电二极管
页数 文件大小 规格书
20页 155K
描述
Dual Bias Resistor Transistors

MUN5213 数据手册

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MUN5211DW1T1 Series  
Preferred Devices  
Dual Bias Resistor  
Transistors  
NPN Silicon Surface Mount Transistors  
with Monolithic Bias Resistor Network  
http://onsemi.com  
The BRT (Bias Resistor Transistor) contains a single transistor with  
a monolithic bias network consisting of two resistors; a series base  
resistor and a base−emitter resistor. These digital transistors are  
designed to replace a single device and its external resistor bias  
network. The BRT eliminates these individual components by  
integrating them into a single device. In the MUN5211DW1T1 series,  
two BRT devices are housed in the SOT−363 package which is ideal  
for low power surface mount applications where board space is at a  
premium.  
(3)  
(2)  
R
(1)  
R
1
2
Q
1
Q
2
R
2
R
1
(4)  
(5)  
(6)  
Simplifies Circuit Design  
Reduces Board Space  
Reduces Component Count  
Available in 8 mm, 7 inch/3000 Unit Tape and Reel  
1
SOT−363  
CASE 419B  
STYLE 1  
MAXIMUM RATINGS  
(T = 25°C unless otherwise noted, common for Q and Q )  
A
1
2
Rating  
Symbol  
Value  
Unit  
Vdc  
Collector-Base Voltage  
Collector-Emitter Voltage  
Collector Current  
V
50  
50  
CBO  
CEO  
MARKING DIAGRAM  
V
Vdc  
6
I
C
100  
mAdc  
d
XX  
THERMAL CHARACTERISTICS  
Characteristic  
(One Junction Heated)  
1
Symbol  
Max  
Unit  
XX= Specific Device Code  
Total Device Dissipation  
P
187 (Note 1.)  
256 (Note 2.)  
1.5 (Note 1.)  
2.0 (Note 2.)  
mW  
D
d
= Date Code  
= (See Page 2)  
T = 25°C  
A
Derate above 25°C  
mW/°C  
°C/W  
Thermal Resistance −  
Junction-to-Ambient  
R
670 (Note 1.)  
490 (Note 2.)  
θ
JA  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking table  
on page 2 of this data sheet.  
Characteristic  
(Both Junctions Heated)  
Symbol  
Max  
Unit  
Total Device Dissipation  
P
250 (Note 1.)  
385 (Note 2.)  
2.0 (Note 1.)  
3.0 (Note 2.)  
mW  
D
Preferred devices are recommended choices for future use  
and best overall value.  
T = 25°C  
A
Derate above 25°C  
mW/°C  
°C/W  
°C/W  
°C  
Thermal Resistance −  
Junction-to-Ambient  
R
493 (Note 1.)  
325 (Note 2.)  
θ
JA  
JL  
Thermal Resistance −  
Junction-to-Lead  
R
188 (Note 1.)  
208 (Note 2.)  
θ
Junction and Storage Temperature T , T  
55 to +150  
J
stg  
1. FR−4 @ Minimum Pad  
2. FR−4 @ 1.0 x 1.0 inch Pad  
Semiconductor Components Industries, LLC, 2003  
1
Publication Order Number:  
December, 2003 − Rev. 5  
MUN5211DW1T1/D  
 

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