MTP10N10EL
Preferred Device
Power MOSFET
10 A, 100 V, Logic Level, N−Channel TO−220
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. The energy efficient design also
offers a drain−to−source diode with a fast recovery time. Designed for
low voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
http://onsemi.com
10 A, 100 V
R
DS(on) = 0.22 W
Features
N−Channel
D
• Avalanche Energy Specified
• Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
G
• I
and V
Specified at Elevated Temperature
DSS
DS(on)
• Pb−Free Package is Available
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
MARKING DIAGRAM
& PIN ASSIGNMENT
Rating
Symbol
Value
100
Unit
Vdc
Vdc
4
4
Drain−to−Source Voltage
V
DSS
DGR
Drain
Drain−to−Gate Voltage (R = 1.0 MW)
V
100
GS
Gate−to−Source Voltage
− Continuous
V
±15
±20
Vdc
Vpk
GS
− Non−Repetitive (t ≤ 10 ms)
V
GSM
p
Drain Current
− Continuous @ T = 25°C
− Continuous @ T = 100°C
− Single Pulse (t ≤ 10 ms)
TO−220AB
CASE 221A
STYLE 5
MTP10N10EL
LLYWW
I
I
10
6.0
35
Adc
Apk
C
D
1
C
D
2
3
I
DM
p
1
Gate
3
Total Power Dissipation @ T = 25°C
Derate above 25°C
P
D
40
0.32
1.75
Watts
W/°C
Watts
C
Source
Total Power Dissipation @ T = 25°C
C
2
(Note 1)
Drain
Operating and Storage Temperature
Range
T , T
−55 to
150
°C
J
stg
MTP10N10EL = Device Code
LL
Y
= Location Code
= Year
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy − Starting T = 25°C
50
J
WW
= Work Week
(V = 25 Vdc, V = 5.0 Vdc, Peak
DD
GS
I = 10 Adc, L = 1.0 mH, R = 25 W)
L
G
ORDERING INFORMATION
Thermal Resistance
− Junction−to−Case°
− Junction−to−Ambient
°C/W
Device
Package
Shipping
R
R
R
3.13
100
71.4
q
JC
JA
JA
q
MTP10N10EL
TO−220AB
50 Units/Rail
50 Units/Rail
− Junction−to−Ambient (Note 1)
q
MTP10N10ELG
TO−220AB
(Pb−Free)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 secs
T
260
°C
L
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
Preferred devices are recommended choices for future use
and best overall value.
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
March, 2005 − Rev. 4
MTP10N10EL/D