Spec. No. : C050V8
Issued Date : 2019.01.22
Revised Date :
CYStech Electronics Corp.
Page No. : 9/9
DFN3×3 Dimension
Marking:
D
D
D D
A9D0
P03
Date
Code
S
S
S
G
8-Lead DFN3×3 Plastic Package
CYStek Package Code: V8
Millimeters
DIM
Inches
Min.
Millimeters
Inches
Min.
0.118
0.094
DIM
Min.
0.70
0.25
0.10
3.25
3.00
1.48
Max.
Max.
0.031
0.014
0.010
0.136
0.126
0.066
Min.
3.00
2.39
Max.
3.20
2.59
Max.
0.126
0.102
A
b
c
0.80
0.35
0.25
3.45
3.20
1.68
0.028
0.010
0.004
0.128
0.118
0.058
E1
E2
e
H
L
L1
θ
M
0.65 BSC
0.026 BSC
D
0.30
0.30
0.50
0.50
0.012
0.012
0.020
0.020
D1
D2
D3
E
0.13 TYP
0.005 TYP
8°
8°
12°
12°
0.13 TYP
0.005 TYP
3.20
3.40
0.126
0.134
-
0.15
-
0.006
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTA9D0P03V8
CYStek Product Specification