4Mb : 256K x 18, 128K x 32/36
FLOW-THROUGH SYNCBURST SRAM
REVISION HISTORY
Rem oved n ote "Not Recom m en ded for New Design s," Rev. 6/01 ................................................................ Jun e 7/01
Added In dustrial Tem perature n ote an d referen ces, Rev. 3/01, FINAL..................................................... March 6/01
Added 119-pin PBGA package, Rev. 1/01, FINAL ................................................................................. Jan uary 10/01
Rem oved FBGA Part Markin g Guide, REV 8/00-A, FINAL ..................................................................... August 22/00
Ch an ged FBGA capacitan ce values, REV 8/00, FINAL .............................................................................. August 7/00
CI; TYP 2.5pF from 4pF; MAX. 3.5pF from 5pF
CO; TYP 4pF from 6pF; MAX. 5pF from 7pF
CCK; TYP 2.5pF from 5pF; MAX. 3.5pF from 6pF
Added FBGA Part Markin g Guide, Rev. 7/00, Prelim in ary .......................................................................... July 17/00
Added revision h istory
Rem oved in dustrial tem perature referen ces
Added 165-pin FBGA package, Rev. 6/00, Prelim in ary ............................................................................... May 23/00
4Mb: 256K x 18, 128K x 32/36 Flow-Through SyncBurst SRAM
MT58L256L18F1_D.p65 – Rev. 10/01
Micron Technology, Inc., reservesthe right to change productsor specificationswithout notice.
©2001, Micron Technology, Inc.
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