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MT36VDDT12872G-265 PDF预览

MT36VDDT12872G-265

更新时间: 2024-11-24 01:03:31
品牌 Logo 应用领域
镁光 - MICRON 动态存储器双倍数据速率
页数 文件大小 规格书
18页 730K
描述
DDR SDRAM RDIMM

MT36VDDT12872G-265 数据手册

 浏览型号MT36VDDT12872G-265的Datasheet PDF文件第2页浏览型号MT36VDDT12872G-265的Datasheet PDF文件第3页浏览型号MT36VDDT12872G-265的Datasheet PDF文件第4页浏览型号MT36VDDT12872G-265的Datasheet PDF文件第5页浏览型号MT36VDDT12872G-265的Datasheet PDF文件第6页浏览型号MT36VDDT12872G-265的Datasheet PDF文件第7页 
1GB, 2GB, 4GB (x72, ECC, DR) 184-Pin DDR RDIMM  
Fe a t u re s  
DDR SDRAM RDIMM  
MT36VDDT12872 – 1GB1  
MT36VDDT25672 – 2GB1  
MT36VDDT51272 – 4GB  
For component data sheets, refer to Microns Web site: www.micron.com  
Fig u re 2:  
Lo w -Pro file La yo u t (MO-206)  
Fe a t u re s  
• 184-pin, registered dual in-line memory module  
PCB height: 30.48mm (1.2in)  
(RDIMM)  
• Standard and low profile height PCB modules  
• Fast data transfer rates: PC2100 or PC2700  
• 1GB (128 Meg x 72), 2GB (256 Meg x 72),  
and 4GB (512 Meg x 72)  
• Supports ECC error detection and correction  
• VDD = VDDQ = +2.5V  
• VDDSPD = +2.3V to +3.6V  
Op t io n s  
• Operating temperature  
Commercial (0°C T +70°C)  
Industrial (–40°C T +85°C)  
Ma rkin g  
• 2.5V I/ O (SSTL_2-compatible)  
• Internal, pipelined double data rate (DDR)  
2n-prefetch architecture  
• Bidirectional data strobe (DQS) transmitted/  
received with data—that is, source-synchronous  
data capture  
• Differential clock inputs (CK and CK#)  
• Multiple internal device banks for concurrent  
operation  
2
None  
I
A
A
• Package  
184-pin DIMM (standard)  
184-pin DIMM (Pb-free)  
• Memory clock, speed, CAS latency  
6.0ns (167 MHz), 333 MT/ s, CL = 2.5  
7.5ns (133 MHz), 266 MT/ s, CL = 2  
G
Y
3
-335  
-262  
-26A  
-265  
4
• Dual rank  
• Selectable burst lengths (BL): 2, 4, or 8  
Auto precharge option  
4
7.5ns (133 MHz), 266 MT/ s, CL = 2  
7.5ns (133 MHz), 266 MT/ s, CL = 2  
Auto refresh and self refresh modes: 7.8125µs  
maximum average periodic refresh interval  
• Serial presence-detect (SPD) with EEPROM  
• Selectable CAS latency (CL) for maximum  
compatibility  
Notes: 1. End of life.  
2. Contact Micron for industrial temperature  
module offerings.  
3. CL = CAS (READ) latency; registered mode  
will add one clock cycle to CL.  
• Gold edge contacts  
4. Not recommended for new designs.  
184-Pin RDIMM Fig u re s  
Fig u re 1:  
St a n d a rd -He ig h t La yo u t (MO-206)  
PCB height: 43.18mm (1.7in)  
PDF: 09005aef809d5451/Source: 09005aef807da325  
dd36c128_256_512x72.fm - Rev. F 6/08 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2003 Micron Technology, Inc. All rights reserved.  
1
Products and specifications discussed herein are subject to change by Micron without notice.  

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