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MSP430F5324IZQER PDF预览

MSP430F5324IZQER

更新时间: 2024-11-29 11:58:15
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路装置时钟
页数 文件大小 规格书
102页 1004K
描述
MIXED SIGNAL MICROCONTROLLER

MSP430F5324IZQER 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:BGA-80针数:80
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.31.00.01Factory Lead Time:12 weeks
风险等级:1.37Is Samacsys:N
具有ADC:YES地址总线宽度:
位大小:16边界扫描:YES
CPU系列:MSP430最大时钟频率:25 MHz
DAC 通道:NODMA 通道:YES
外部数据总线宽度:格式:FIXED POINT
JESD-30 代码:S-PBGA-B80JESD-609代码:e1
长度:5 mm低功率模式:YES
湿度敏感等级:3DMA 通道数量:3
外部中断装置数量:I/O 线路数量:63
串行 I/O 数:2端子数量:80
计时器数量:18片上数据RAM宽度:8
片上程序ROM宽度:8最高工作温度:85 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装等效代码:BGA80,9X9,20封装形状:SQUARE
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:2/3.3 V认证状态:Not Qualified
RAM(字节):6144RAM(字数):6
ROM(单词):65536ROM可编程性:FLASH
座面最大高度:1 mm速度:25 MHz
子类别:Microcontrollers最大压摆率:11 mA
最大供电电压:3.6 V最小供电电压:2.4 V
标称供电电压:3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:5 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

MSP430F5324IZQER 数据手册

 浏览型号MSP430F5324IZQER的Datasheet PDF文件第2页浏览型号MSP430F5324IZQER的Datasheet PDF文件第3页浏览型号MSP430F5324IZQER的Datasheet PDF文件第4页浏览型号MSP430F5324IZQER的Datasheet PDF文件第5页浏览型号MSP430F5324IZQER的Datasheet PDF文件第6页浏览型号MSP430F5324IZQER的Datasheet PDF文件第7页 
MSP430F532x  
www.ti.com  
SLAS678C AUGUST 2010REVISED NOVEMBER 2011  
MIXED SIGNAL MICROCONTROLLER  
1
FEATURES  
2
Low Supply-Voltage Range: 1.8 V to 3.6 V  
16-Bit Timer TA0, Timer_A With Five  
Capture/Compare Registers  
Ultralow Power Consumption  
16-Bit Timer TA1, Timer_A With Three  
Capture/Compare Registers  
Active Mode (AM):  
All System Clocks Active  
290 µA/MHz at 8 MHz, 3 V, Flash Program  
Execution (Typical)  
150 µA/MHz at 8 MHz, 3 V, RAM Program  
Execution (Typical)  
16-Bit Timer TA2, Timer_A With Three  
Capture/Compare Registers  
16-Bit Timer TB0, Timer_B With Seven  
Capture/Compare Shadow Registers  
Standby Mode (LPM3):  
Two Universal Serial Communication  
Interfaces  
Real Time Clock With Crystal , Watchdog,  
and Supply Supervisor Operational, Full  
RAM Retention, Fast Wake-Up:  
1.9 µA at 2.2 V, 2.1 µA at 3 V (Typical)  
Low-Power Oscillator (VLO), General  
Purpose Counter, Watchdog, and Supply  
Supervisor Operational, Full RAM  
Retention, Fast Wake-Up:  
USCI_A0 and USCI_A1 Each Supporting  
Enhanced UART supporting  
Auto-Baudrate Detection  
IrDA Encoder and Decoder  
Synchronous SPI  
USCI_B0 and USCI_B1 Each Supporting  
1.4 µA at 3 V (Typical)  
I2CTM  
Off Mode (LPM4):  
Synchronous SPI  
Full RAM Retention, Supply Supervisor  
Operational, Fast Wake-Up:  
1.1 µA at 3 V (Typical)  
Integrated 3.3-V Power System  
12-Bit Analog-to-Digital (A/D) Converter With  
Internal Reference, Sample-and-Hold, and  
Autoscan Feature  
Shutdown Mode (LPM4.5):  
0.18 µA at 3 V (Typical)  
Comparator  
Wake-Up From Standby Mode in 3.5 µs  
(Typical)  
Hardware Multiplier Supporting 32-Bit  
Operations  
16-Bit RISC Architecture, Extended Memory,  
Up to 25-MHz System Clock  
Serial Onboard Programming, No External  
Programming Voltage Needed  
Flexible Power Management System  
Three Channel Internal DMA  
Fully Integrated LDO With Programmable  
Regulated Core Supply Voltage  
Basic Timer With Real-Time Clock Feature  
Family Members are Summarized in Table 1  
Supply Voltage Supervision, Monitoring,  
and Brownout  
For Complete Module Descriptions, See the  
MSP430x5xx/MSP430x6xx Family User's Guide  
(SLAU208)  
Unified Clock System  
FLL Control Loop for Frequency  
Stabilization  
Low-Power/Low-Frequency Internal Clock  
Source (VLO)  
Low-Frequency Trimmed Internal Reference  
Source (REFO)  
32-kHz Watch Crystals (XT1)  
High-Frequency Crystals Up to 32 MHz  
(XT2)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 20102011, Texas Instruments Incorporated  

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