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MSP430F5132IYFFR PDF预览

MSP430F5132IYFFR

更新时间: 2024-11-29 11:06:23
品牌 Logo 应用领域
德州仪器 - TI 时钟控制器微控制器微控制器和处理器静态存储器外围集成电路比较器闪存
页数 文件大小 规格书
103页 1598K
描述
具有 8KB 闪存、1KB SRAM、10 位 ADC、比较器、DMA 和 16 位高分辨率计时器的 25MHz MCU | YFF | 40 | -40 to 85

MSP430F5132IYFFR 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:BGA包装说明:VFBGA, BGA40,6X7,16
针数:40Reach Compliance Code:compliant
HTS代码:8542.31.00.01Factory Lead Time:26 weeks
风险等级:5.41Samacsys Description:MCU 16-bit MSP430 RISC 8KB Flash 2.5V/3.3V 40-Pin DSBGA T/R
具有ADC:YES其他特性:ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 12 MHZ
地址总线宽度:位大小:16
边界扫描:YESCPU系列:MSP430
最大时钟频率:25 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:
集成缓存:NOJESD-30 代码:R-XBGA-B40
JESD-609代码:e1长度:3.06 mm
低功率模式:YES湿度敏感等级:1
DMA 通道数量:3I/O 线路数量:31
端子数量:40片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:UNSPECIFIED
封装代码:VFBGA封装等效代码:BGA40,6X7,16
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIEDRAM(字节):1024
ROM(单词):8192ROM可编程性:FLASH
座面最大高度:0.625 mm速度:25 MHz
最大压摆率:6.15 mA最大供电电压:3.6 V
最小供电电压:2.4 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.4 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.76 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC

MSP430F5132IYFFR 数据手册

 浏览型号MSP430F5132IYFFR的Datasheet PDF文件第2页浏览型号MSP430F5132IYFFR的Datasheet PDF文件第3页浏览型号MSP430F5132IYFFR的Datasheet PDF文件第4页浏览型号MSP430F5132IYFFR的Datasheet PDF文件第5页浏览型号MSP430F5132IYFFR的Datasheet PDF文件第6页浏览型号MSP430F5132IYFFR的Datasheet PDF文件第7页 
MSP430F51x1  
MSP430F51x2  
www.ti.com  
SLAS619I AUGUST 2010REVISED FEBRUARY 2013  
MIXED SIGNAL MICROCONTROLLER  
1
FEATURES  
23  
Low Supply Voltage Range:  
3.6 V Down to 1.8 V  
16-Bit Timer TD0 With Three Capture/Compare  
Registers and Support of High-Resolution  
Mode  
Ultralow Power Consumption  
16-Bit Timer TD1 With Three Capture/Compare  
Registers and Support of High-Resolution  
Mode  
Active Mode (AM): 180 µA/MHz  
Standby Mode (LPM3 WDT Mode, 3 V):  
1.1 µA  
16-Bit Timer TA0 With Three Capture/Compare  
Registers  
Universal Serial Communication Interfaces(1)  
Off Mode (LPM4 RAM Retention, 3 V):  
0.9 µA  
Shutdown Mode (LPM4.5, 3 V): 0.25 µA  
USCI_A0 Supporting  
Wake-Up From Standby Mode in Less Than  
5 µs  
Enhanced UART Supporting Auto-  
Baudrate Detection  
16-Bit RISC Architecture, Extended Memory,  
40-ns Instruction Cycle Time  
IrDA Encoder and Decoder  
Synchronous SPI  
Flexible Power Management System  
USCI_B0 Supporting  
Fully Integrated LDO With Programmable  
Regulated Core Supply Voltage  
I2C™  
Supply Voltage Supervision, Monitoring,  
and Brownout  
Synchronous SPI  
10-Bit 200-ksps Analog-to-Digital (A/D)  
Converter  
Unified Clock System  
FLL Control Loop for Frequency  
Stabilization  
Internal Reference  
Sample-and-Hold  
Autoscan Feature  
Low-Power Low-Frequency Internal Clock  
Source (VLO)  
Up to Eight External Channels, Two Internal  
Channels, Including Temperature Sensor(1)  
Low-Frequency Trimmed Internal Reference  
Source (REFO)  
Up to 16-Channel On-Chip Comparator  
Including an Ultralow-Power Mode(1)  
32-kHz Crystals (XT1)  
High-Frequency Crystals up to 25 MHz  
(XT1)  
Serial Onboard Programming, No External  
Programming Voltage Needed  
Hardware Multiplier Supporting 32-Bit  
Operations  
Family Members are Summarized in Table 1  
Available in 40-Pin QFN (RSB) and 38-Pin  
TSSOP (DA) Packages (See Table 2)  
Three Channel DMA  
Up to Twelve 5-V Tolerant Digital Push/Pull  
I/Os With Up to 20-mA Drive Strength(1)  
For Complete Module Descriptions, See the  
MSP430x5xx and MSP430x6xx Family User's  
(1)  
Guide (SLAU208)  
(1) Full functionality in the 40-pin QFN package options. For the  
available features of other packages see Terminal Functions.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
MSP430 is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010–2013, Texas Instruments Incorporated  

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