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MSP430F423AIPM PDF预览

MSP430F423AIPM

更新时间: 2024-11-25 10:44:55
品牌 Logo 应用领域
德州仪器 - TI 微控制器
页数 文件大小 规格书
45页 841K
描述
MIXED SIGNAL MICROCONTROLLER

MSP430F423AIPM 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFP
包装说明:LFQFP, QFP64,.47SQ,20针数:64
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:0.78具有ADC:YES
其他特性:ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ地址总线宽度:
位大小:16边界扫描:YES
CPU系列:MSP430最大时钟频率:8 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:格式:FIXED POINT
集成缓存:NOJESD-30 代码:S-PQFP-G64
JESD-609代码:e4长度:10 mm
低功率模式:YES湿度敏感等级:3
DMA 通道数量:外部中断装置数量:
I/O 线路数量:14串行 I/O 数:1
端子数量:64计时器数量:4
片上数据RAM宽度:8片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装等效代码:QFP64,.47SQ,20
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:2/3.3 V
认证状态:Not QualifiedRAM(字节):256
RAM(字数):0.25ROM(单词):8192
ROM可编程性:FLASH座面最大高度:1.6 mm
速度:8 MHz子类别:Microcontrollers
最大压摆率:0.5 mA最大供电电压:3.6 V
最小供电电压:2.7 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MSP430F423AIPM 数据手册

 浏览型号MSP430F423AIPM的Datasheet PDF文件第2页浏览型号MSP430F423AIPM的Datasheet PDF文件第3页浏览型号MSP430F423AIPM的Datasheet PDF文件第4页浏览型号MSP430F423AIPM的Datasheet PDF文件第5页浏览型号MSP430F423AIPM的Datasheet PDF文件第6页浏览型号MSP430F423AIPM的Datasheet PDF文件第7页 
MSP430F42xA  
MIXED SIGNAL MICROCONTROLLER  
SLAS587 -- FEBRUARY 2008  
D
D
Low Supply-Voltage Range, 1.8 V to 3.6 V  
D
D
Supply Voltage Supervisor/Monitor With  
Programmable Level Detection  
Ultra-Low Power Consumption:  
-- Active Mode: 400 μA at 1 MHz, 3.0 V  
-- Standby Mode: 1.6 μA  
Serial Onboard Programming,  
No External Programming Voltage Needed,  
Programmable Code Protection by Security  
Fuse  
-- Off Mode (RAM Retention): 0.1 μA  
D
D
Five Power-Saving Modes  
D
D
Bootstrap Loader in Flash Devices  
Wake-Up From Standby Mode in Less  
Than 6 μs  
Family Members Include:  
-- MSP430F423A:  
8KB + 256B Flash Memory,  
256B RAM  
-- MSP430F425A:  
16KB + 256B Flash Memory,  
512B RAM  
-- MSP430F427A:  
32KB + 256B Flash Memory,  
1KB RAM  
D
D
Frequency-Locked Loop, FLL+  
16-Bit RISC Architecture, 125-ns  
Instruction Cycle Time  
D
D
Three Independent 16-bit Sigma-Delta A/D  
Converters With Differential PGA Inputs  
16-Bit Timer_A With Three  
Capture/Compare Registers  
D
D
Integrated LCD Driver for 128 Segments  
D
D
Available in 64-Pin Quad Flat Pack (QFP)  
Serial Communication Interface (USART),  
Asynchronous UART, or Synchronous SPI  
Selectable by Software  
For Complete Module Descriptions, Refer  
to the MSP430x4xx Family User’s Guide,  
Literature Number SLAU056  
D
Brownout Detector  
description  
The Texas Instruments MSP430 family of ultra-low power microcontrollers consists of several devices featuring  
different sets of peripherals targeted for various applications. The architecture, combined with five low-power  
modes, is optimized to achieve extended battery life in portable measurement applications. The device features  
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code  
efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less  
than 6 μs.  
The MSP430F42xA series are microcontroller configurations with three independent 16-bit sigma-delta A/D  
converters, each with an integrated differential programmable gain amplifier input stage. Also included are a  
built-in 16-bit timer, 128 LCD segment drive capability, hardware multiplier, and 14 I/O pins.  
Typical applications include high-resolution applications such as handheld metering equipment, weigh scales,  
and energy meters.  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range  
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage  
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited  
built-in ESD protection.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
Copyright © 2008 Texas Instruments Incorporated  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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