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MSP1N5281UR-1 PDF预览

MSP1N5281UR-1

更新时间: 2024-11-21 05:25:15
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
3页 152K
描述
Zener Diode, 200V V(Z), 20%, 0.5W, Silicon, Unidirectional, DO-213AA, HERMETIC SEALED, GLASS, MLL34, MELF-2

MSP1N5281UR-1 数据手册

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1N5221UR-1 thru 1N5281BUR-1,e3  
(or MLL5221-1 thru MLL5281B-1,e3)  
METALLURGICALLY BONDED GLASS  
SURFACE MOUNT 500 mW ZENERS  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The 1N5221BUR-1 thru 1N5281BUR-1 series of 0.5 watt Zener Voltage  
Regulators provides a surface mount equivalent to the popular JEDEC  
registered 1N5221B to 1N5281B for 2.4 to 200 volts in a metallurgically  
bonded configuration. They are available with standard 5%, 10%, or 20%  
tolerances as well as tighter tolerances identified by different suffix letters on  
the part number. Microsemi also offers numerous other Zener products to  
meet higher and lower power applications.  
DO-213AA  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount equivalents to the JEDEC registered  
1N5221 thru 1N5281B series  
Regulates voltage over a broad operating  
current and temperature range  
Hermetically sealed surface mount package  
Internal metallurgical bond  
Selection from 2.4 to 200 V  
Standard voltage tolerances are plus/minus 5%  
with B suffix identification and 10 % with A suffix  
Tight tolerances available in plus or minus 2%  
or 1% with C or D suffix respectively  
Options for screening in accordance with MIL-PRF-  
19500 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or MSP prefixes  
respectively to part numbers  
Nonsensitive to ESD per MIL-STD-750 Method 1020  
Minimal capacitance (see Figure 3)  
RoHS Compliant devices available by adding “e3” suffix  
DO-7 or DO-35 glass body axial-leaded Zener  
equivalents also available per JEDEC registration (see  
separate data sheet for part numbers 1N5221 thru  
1N5281B series  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Operating and Storage temperature: -65ºC to +175ºC  
CASE: Hermetically sealed glass DO-213AA  
(SOD80 or MLL34) MELF style package  
Thermal Resistance: 100ºC/W junction to end cap  
and 250ºC/W junction to ambient when mounted on  
FR4 PC board (1 oz Cu) with recommended footprint  
(see last page)  
FINISH: End caps Tin-Lead or RoHS Compliant  
annealed matte-Tin plating solderable per MIL-STD-  
750, method 2026  
Steady-State Power: 0.5 watts at end cap  
temperature TEC < 125oC or ambient temperature TA  
< 50ºC when mounted on FR4 PC board as described  
for thermal resistance above (see Figure 2 for  
derating)  
POLARITY: Cathode indicated by band where  
diode is to be operated with the banded end positive  
with respect to the opposite end for Zener regulation  
MARKING: cathode band only  
TAPE & REEL option: Standard per EIA-481-B with  
12 mm tape, 2000 per 7 inch reel or 5000 per 13  
inch reel (add “TR” suffix to part number)  
WEIGHT: 0.04 grams  
Forward voltage @200 mA: 1.1 volts (maximum)  
Solder Temperatures: 260 ºC for 10 seconds (max)  
See package dimensions on last page  
Copyright © 2005  
8-29-2005 REV A  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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