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MSK1755 PDF预览

MSK1755

更新时间: 2024-11-24 19:42:07
品牌 Logo 应用领域
MSK 驱动接口集成电路
页数 文件大小 规格书
3页 237K
描述
Buffer/Inverter Based Peripheral Driver, 2A, CDFP26, HERMETIC SEALED, FLAT PACK-26

MSK1755 技术参数

生命周期:Transferred零件包装代码:DFP
包装说明:DFP,针数:26
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.68
接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVERJESD-30 代码:S-CDFP-F26
长度:19.05 mm功能数量:1
端子数量:26最高工作温度:125 °C
最低工作温度:-55 °C输出电流流向:SINK
标称输出峰值电流:2 A封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DFP封装形状:SQUARE
封装形式:FLATPACK认证状态:Not Qualified
座面最大高度:3.429 mm标称供电电压:31.5 V
表面贴装:YES温度等级:MILITARY
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL断开时间:100 µs
接通时间:50 µs宽度:19.05 mm
Base Number Matches:1

MSK1755 数据手册

 浏览型号MSK1755的Datasheet PDF文件第2页浏览型号MSK1755的Datasheet PDF文件第3页 
MIL-PRF-38534 CERTIFIED  
RAD HARD QUAD  
HIGH SIDE DRIVER  
1755  
M.S.KENNEDY CORP.  
4707 Dey Road Liverpool, N.Y. 13088  
(315) 701-6751  
FEATURES:  
RAD HARD MOSFETs  
Quad Configuration  
Available Fully Screened to MIL-PRF-38534  
Surface Mount Flatpack  
Low Profile  
100V/2A Max. Ratings for Switches  
Series Diode for Each Output  
DESCRIPTION:  
The MSK 1755 is a radiation hardened quad high side driver module. The device is designed for space applications  
where quality, performance and low weight are a must. The MSK 1755 is packaged in a hermetic 26 pin flatpack.  
EQUIVALENT SCHEMATIC  
TYPICAL APPLICATIONS  
PIN-OUT INFORMATION  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
High Side Switch Drivers  
High Level Switching  
Space Applications  
VCC  
VCC  
VCC  
VCC  
VCC  
VIN1  
GND  
VIN2  
GND  
VIN3  
GND  
VIN4  
GND  
26 OUT1  
25 OUT1  
24 VCC  
23 VCC  
22 OUT2  
21 OUT2  
20 VCC  
19 VCC  
18 OUT3  
17 OUT3  
16 VCC  
15 OUT4  
14 OUT4  
PRELIMINARY Rev. A 5/10  
1

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